Electrical interconnect structure

An electrical structure comprising:

• a first substrate comprising a first electrically conductive pad;
• a second substrate comprising a second electrically conductive pad;
• and
• an interconnect structure electrically and mechanically connecting said first electrically conductive pad to said second electrically conductive pad, wherein said interconnect structure comprises a non-solder metallic core structure, a first solder structure in direct mechanical contact with a first portion of said non-solder metallic core structure, and a second solder structure in direct mechanical contact with a second portion of said non-solder metallic core structure, wherein said first solder structure electrically and mechanically connects said first portion of said non-solder metallic core structure to said first electrically conductive pad, and wherein said second solder structure electrically and mechanically connects said second portion of said non-solder metallic core structure to said second electrically conductive pad.