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US 8,476,750 B2Granted
Printed circuit board having embedded dies and method of forming same
AssigneeQUALCOMM Incorporated
InventorsFifin Sweeney, Jason R. Gonzalez
Life of this patent
Estimating the term…
Abstract
A package includes a printed circuit board (PCB) having a first side and a second side and a thickness between the first side and the second side and a stacked die including a top die mounted on a bottom die, the bottom die being at least partially embedded in the PCB. Also a method of forming a package that includes forming an opening in a top surface of the PCB layer, placing a stacked die including a top die stacked on a bottom die into the opening, laminating the PCB layer to form a laminate layer, and forming an electrical connection with the stacked die.
Claims7
A method of forming a package comprising:
- forming an opening in a top surface of a printed circuit board (PCB) layer;
- fabricating a stacked die comprising a top die stacked on a bottom die in the opening, wherein contacts for electrical connection are located on the bottom surface of the bottom die;
- laminating the PCB layer to form a laminate layer, wherein the laminate layer is a top laminate layer formed on the top surface, and wherein at least a portion of the top die protrudes from a top surface of the laminate layer in an upward direction;
- and
- forming an electrical connection with the stacked die.
2 more elements
Dependencies are inferred from the claim text.