Exposed die overmolded flip chip package and fabrication method

An exposed die overmolded flip chip package comprising:

• a substrate comprising a first surface;
• a die comprising:
• an active surface;
• an inactive surface opposite the active surface;
• and
• sides extending between the active surface and the inactive surface;
• a mold cap comprising a moat surrounding the die, the moat comprising a channel in a principal surface of the mold cap, wherein a portion of the sides of the die are exposed from the mold cap;
• and
• electrically conductive vias extending through the mold cap.

A method comprising:

• mounting a die to a substrate with flip chip bumps;
• forming a mold cap comprising a moat surrounding the die, the moat comprising a channel in a principal surface of the mold cap, wherein an inactive surface and a portion of sides of the die are exposed from the mold cap;
• forming openings in the mold cap;
• and
• filling the openings with an electrically conductive material to form vias.