Leadframe, leadframe type package and lead lane
AssigneeVIA Technologies, Inc.
InventorSheng-Yuan Lee
Life of this patent
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Abstract
A leadframe for a leadframe type package includes a chip base, and leads constituting lead lanes. One lead lane includes a pair of first differential signal leads, a pair of second differential signal leads, a pair of third differential signal leads between which and the pair of first differential signal leads is arranged the pair of second differential signal leads and a first power lead arranged between the pair of first and second differential signal leads. One of the pairs of differential signal leads has half-duplex transmission mode and two of the other pairs of differential signal leads have full-duplex transmission mode.
Claims20
A leadframe, suitable for a leadframe type package and comprising:
- a chip base;
- and
- a plurality of leads, constituting a plurality of lead lanes, wherein one of the lead lanes comprises:
- a pair of first differential signal leads;
- a pair of second differential signal leads;
- a pair of third differential signal leads, wherein the pair of second differential signal leads is arranged between the pair of first differential signal leads and the pair of third differential signal leads;
- and
- a first power lead, arranged between the pair of first differential signal leads and the pair of second differential signal leads,
- wherein one of the pairs of differential signal leads has a half-duplex transmission mode and two of the other pairs of differential signal leads have a full-duplex transmission mode.
A leadframe type package, comprising:
- a leadframe;
- a chip;
- a plurality of conductive wires, connected between the leadframe and the chip;
- and
- an encapsulant, encapsulating the chip and the conductive wires,
- wherein the leadframe comprises:
- a chip base, on which the chip is disposed;
- and
- a plurality of leads, constituting a plurality of lead lanes, wherein one of the lead lanes comprises:
- a pair of first differential signal leads;
- a pair of second differential signal leads;
- a pair of third differential signal leads, wherein the pair of second differential signal leads is arranged between the pair of first differential signal leads and the pair of third differential signal leads;
- and
- a first power lead, arranged between the pair of first differential signal leads and the pair of second differential signal leads,
- wherein one of the pairs of differential signal leads has a half-duplex transmission mode and two of the other pairs of differential signal leads have a full-duplex transmission mode.
A lead lane, suitable for a leadframe of a leadframe type package and comprising:
- a pair of first differential signal leads;
- a pair of second differential signal leads;
- a pair of third differential signal leads, wherein the pair of second differential signal leads is arranged between the pair of first differential signal leads and the pair of third differential signal leads;
- and
- a first power lead, arranged between the pair of first differential signal leads and the pair of second differential signal leads,
- wherein one of the pairs of differential signal leads has a half-duplex transmission mode and two of the other pairs of differential signal leads have a full-duplex transmission mode.
Dependencies are inferred from the claim text.