Package structure enhancing molding compound bondability

A package structure enhancing molding compound bondability, comprising:

• a leadframe, including a chip base and a pin holder, wherein the chip base includes a chip pad and a support, the chip pad includes a side protrusion extending out of the support, and the side protrusion has a lower surface, and the support has a sidewall, and wherein the lower surface of the chip pad and the sidewall of the support interconnect at an intersection line, the lower surface of the chip pad is formed upwardly with a recess adjacent to and extending along part of the intersection line, and wherein the pin holder includes a pin stand and a seat, the pin stand has an edge portion extending out of the seat, the edge portion has a lower surface, the seat has a sidewall, and wherein the lower surface of the pin stand and the sidewall of the seat interconnect at a crossing line, and the lower surface is formed upwardly with a recess adjacent to and along at least part of the crossing line, and wherein the pin stand of the pin holder is laid with at least one metal pin;
• a chip, being fixed on the chip pad, wherein the chip, at its upper surface, is provided with at least one solder spot;
• at least one wire, being electrically connected with the at least one solder spot of the chip and the at least one metal pin of the pin holder;
• and
• a molding compound, for encapsulating the chip, the at least one wire, and part of the leadframe, and for filling the recesses.