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US 8,476,742 B2Granted
Fluid ejection device comprising substrate contact via
AssigneeHewlett-Packard Development Company, L.P.
InventorsGregory N. Burton, Paul I. Mikulan
Life of this patent
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Abstract
Edges of a first conductive layer (104) and a silicate glass layer (106) extend adjacent one another along a via (164) extending to a semiconductor substrate (41). An electrical conductor (112/114) extends through the via (164) into contact with the semiconductor substrate (41).
Claims20
An apparatus comprising:
- a semiconductor substrate;
- a first conductive layer on the substrate;
- a silicate glass layer on the first conductive layer, the silicate glass layer and the first conductive layer having edges along a via extending to the substrate;
- a second conductive layer on the silicate glass layer;
- a dielectric layer on the second conductive layer;
- and
- a third conductive layer on the dielectric layer, the third conductive layer in electrical contact with the second conductive layer and extending through the via into electrical contact with the substrate, wherein the second conductive layer has edges about the via outwardly spaced from the edges of the first conductive layer.
4 more elements
An apparatus comprising:
- a semiconductor substrate;
- a first conductive layer on the substrate;
- a silicate glass layer on the first conductive layer, the silicate glass layer and the first conductive layer having edges along a via extending to the substrate;
- a second conductive layer on the silicate glass layer;
- a dielectric layer on the second conductive layer;
- and
- a third conductive layer on the dielectric layer, the third conductive layer in electrical contact with the second conductive layer and extending through the via into electrical contact with the substrate, wherein the third conductive layer covers and contacts edges of the first conductive layer and the silicate glass layer proximate the via.
4 more elements
An apparatus comprising:
- a semiconductor substrate;
- a first conductive layer on the substrate;
- a silicate glass layer on the first conductive layer, the silicate glass layer and the first conductive layer having edges along a via extending to the substrate;
- a second conductive layer on the silicate glass layer;
- a dielectric layer on the second conductive layer;
- and
- a third conductive layer on the dielectric layer, the third conductive layer in electrical contact with the second conductive layer and extending through the via into electrical contact with the substrate, wherein the dielectric layer covers edges of the second conductive layer proximate the via and wherein the dielectric layer extends from above the second conductive layer to below the second conductive layer across the edges of the second conductive layer.
4 more elements
Dependencies are inferred from the claim text.