US 8,476,737 B2Granted

Environment-resistant module, micropackage and methods of manufacturing same

AssigneeThe Regents of the University of Michigan

InventorsKhalil Najafi, Sang-Hyun Lee, Sang Woo Lee

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Abstract

An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.

Claims11

Dependent claims

A micropackage comprising:

a semiconductor wafer having at least one isolated portion, each isolated portion being electrically isolated from the rest of the wafer by air gaps or trenches;
a thin support layer or film of insulating material formed on the wafer for supporting the isolated portion, the support layer being substantially planar in a lateral direction and being at least partially defined by a single wafer, the support layer or film having at least one hole extending completely therethrough, wherein each hole is generally aligned with at least a portion of one of the respective isolated portions;
and
electrically conductive material formed in each hole and electrically connected to each isolated portion of the wafer, wherein each isolated portion is supported by a supporting portion of the thin layer or film, the conductive material and the isolated portion of the wafer forming a substantially vertical feedthrough extending through the wafer for signal transfer through the wafer and the thin layer or film and through the micropackage.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 13/273,402Filed 14 Oct 2011 · continuation
Priority: 7 Jun 2007
Published: US 2012/0032346 A19 Feb 2012
Granted: 2 Jul 2013
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

B81B 3/0018
Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes: structures acting upon the moving or flexible…
B81B 7/0038
For maintaining a controlled atmosphere inside of the chamber containing the MEMS: using materials for controlling the level of pressure,…
B81B 7/0058
Packages or encapsulation: for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
B81B 7/0064
Packages or encapsulation: for protecting against electromagnetic or electrostatic interferences

Family

Application60/942,511Us provisional application · filed 7 Jun 2007
Application12/135,532Parent of this continuation · filed 9 Jun 2008
US 2012/0032346 A1Pre-grant publication · published 9 Feb 2012
US 8,049,326 B2Parent of this continuation
US 2009/0085191 A1Published application
US 8,476,737 B2This patent

From the US filing history. Foreign family members aren’t listed.