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US 8,476,726 B2Granted
Semiconductor device and method of manufacturing the semiconductor device
AssigneeNichia Corporation
InventorSatoshi Shirahama
Life of this patent
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Abstract
Provided is a semiconductor device and a method of manufacturing the semiconductor device, in which the semiconductor device has a semiconductor element having a plurality of wires bonded to the semiconductor element with sufficient bonding reliability and has a good heat dissipation property. A semiconductor device in which a first wire is ball bonded on an electrode, and a second wire is further bonded on the ball-bonded first wire, and the first wire or an end of the second wire defines a space between itself and the ball portion of the first wire.
Claims8
A semiconductor device comprising:
- a light emitting element, including a semiconductor layer, mounted on a member;
- an electrode provided on the semiconductor layer;
- a first wire ball-bonded on the electrode, the first wire having a ball portion bonded on the electrode and a folded portion extended from the ball portion and folded back onto itself, wherein a portion extending toward the folded portion and a portion extending from the folded portion are in contact with each other over the ball portion;
- a second wire bonded to the first wire over the ball portion;
- and
- a light transmissive resin located in a window exposing a portion of the member and covering the electrode, the first wire and the second wire;
- wherein the folded portion of the first wire or the second wire and the ball portion define a space therebetween at a location over a peripheral portion on the ball portion.
4 more elements
A semiconductor device comprising:
- a light emitting element, including a semiconductor layer, mounted on a member;
- an electrode provided on the semiconductor layer;
- a first wire ball-bonded on the electrode, the first wire having a ball portion bonded on the electrode and a folded portion extended from the ball portion and folded back onto itself, wherein a portion extending toward the folded portion and a portion extending from the folded portion are in contact with each other over the ball portion;
- a second wire bonded on the first wire over the ball portion;
- and
- a light transmissive resin located in a window exposing a portion of the member and covering the electrode, the first wire and the second wire;
- wherein the folded portion of the first wire and the second wire define a space therebetween at a location over a peripheral portion on the ball portion.
4 more elements
Dependencies are inferred from the claim text.