High voltage low current surface emitting LED
AssigneeCree, Inc.
InventorsJames Ibbetson, Sten Heikman
Life of this patent
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Abstract
An LED chip comprising a plurality of sub-LEDs on a submount. Electrically conductive and electrically insulating features are included that serially interconnect the sub-LEDs such that an electrical signal applied to the serially interconnected sub-LEDs along the electrically conductive features spreads to the serially interconnected sub-LEDs. A via is included that is arranged to electrically couple one of the sub-LEDs to the submount. The sub-LEDs can be interconnected by more than one of the conductive features, with each one of the conductive features capable of spreading an electrical signal between two of the sub-LEDs.
Claims29
A LED chip, comprising:
- a plurality of sub-LEDs collectively bonded by a common bond layer to a submount, wherein the common bond layer does not electrically interconnect the plurality of sub-LEDs;
- electrically conductive and electrically insulating features serially interconnecting said sub-LEDs;
- and
- at least one via arranged to electrically couple at least one of said sub-LEDs to said submount.
A LED chip, comprising:
- a plurality of sub-LEDs mounted on a submount;
- connector traces serially interconnecting said sub-LEDs;
- insulating features to insulate portions of said sub-LEDs from said connector traces;
- at least one bottom contact disposed between at least one of said sub-LEDs and said submount;
- and
- at least one via extending perpendicularly from said submount to contact a sidewall of said at least one bottom contact of said at least one of said sub-LEDs.
A LED chip, comprising:
- a plurality of sub-LEDs on a submount;
- and
- a plurality of electrically conductive features serially interconnecting at least some of said sub-LEDs, wherein at least two of said sub-LEDs are electrically interconnected by more than one of said conductive features that provide at least one redundant electrical connection between the at least two of said sub-LEDs, each one of said conductive features capable of spreading an electrical signal between said two of said sub-LEDs.
A LED chip, comprising:
- a plurality of sub-LEDs on a submount;
- and
- a plurality of electrically conductive paths serially connecting at least some of said sub-LEDs, wherein first and second contacts of respective adjacent first and second ones of said serially connected sub-LEDs are connected by more than one of said electrically conductive paths.
Dependencies are inferred from the claim text.