Film-covered LED device
OwnerPei-Ling Liaoinventor
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Abstract
A film-covered LED device includes a high thermal conductive substrate, a reflector, a plurality of LED chips, and a fluorescent film. A pair of electrical contacts is respectively disposed on two ends of the high thermal conductive substrate. A thru opening is formed on the reflector, which is disposed on the high thermal conductive substrate. The LED chips are disposed on the high thermal conductive substrate and connected electrically, within the thru opening. The fluorescent film is disposed on the reflector and casted over the LED chips. Thereby, the LEDs illumination is more evenly distributed, in maintaining illumination efficiency uniformity. The yield rate is also enhanced with savings in labor cost.
Claims6
A film-covered LED device, comprising:
- a high thermal conductive substrate having a pair of electrical contacts on two ends thereof respectively;
- a reflector disposed on the high thermal conductive substrate, a thru opening being formed on the reflector;
- a plurality of LED chips disposed on the high thermal conductive substrate within the thru opening and connected electrically;
- a fluorescent film disposed on the reflector and casted over the LED chips;
- and
- a cured clear gel layer disposed on the fluorescent film.
Dependencies are inferred from the claim text.