LED thermal management
AssigneeUni-Light LLC
InventorsGary A. McDaniel, Chip Akins
Life of this patent
Estimating the term…
Abstract
Thermal management solutions for higher power LEDs. In accordance with embodiments, a heat sink, preferably copper, is connected directly to the thermal pad of an LED. Directly connecting the LED thermal pad to the copper heat sink reduces the thermal resistance between the LED package and the heat sink, and more efficiently conducts heat away from the LED through the copper heat sink. In embodiments, the copper heat sink is directly soldered to the LED thermal pad.
Claims20
A light-emitting diode (LED) package and thermal management system, comprising:
- a circuit board or flex circuit having an opening therein;
- an LED package comprising a thermal pad, the LED package mounted to the circuit board or flex circuit with the thermal pad exposed by way of the opening;
- and
- a heat sink directly connected to the thermal pad via solder, at least one of the heat sink, the solder, or the thermal pad extending at least partially through the opening.
A light-emitting diode (LED) package and thermal management system, comprising:
- a circuit board or flex circuit having an opening therein;
- an LED package comprising a thermal pad, the LED package mounted to the circuit board or flex circuit with the thermal pad exposed at the opening;
- and
- a heat sink directly connected to the thermal pad, the heat sink comprising first and second pieces, the first piece being soldered directly to the thermal pad, and the second piece being connected to the first piece.
Dependencies are inferred from the claim text.