Radiation sensor device and method
AssigneeAnalog Devices, Inc.
InventorsOliver Kierse, Eamon Hynes
Life of this patent
Estimating the term…
Abstract
A radiation sensor device including an integrated circuit chip including a radiation sensor on a surface of the integrated chip, one or more electrical connections configured to connect between an active surface of the integrated circuit chip and a lead frame, a cap attached to said integrated circuit chip spaced from and covering said radiation sensor, the cap having a transparent portion defining a primary lens transparent to the radiation to be sensed, a secondary lens disposed in a recess proximate and spaced from said primary lens transparent to the radiation to be sensed, and an air gap between said primary lens and said secondary lens.
Claims10
A radiation sensor device comprising:
- an integrated circuit chip including a radiation sensor on a surface of the integrated chip;
- one or more electrical connections configured to connect between an active surface of the integrated circuit chip and a lead frame;
- a cap attached to said integrated circuit chip spaced from and covering said radiation sensor, the cap having a transparent portion defining a primary lens transparent to the radiation to be sensed the primary lens having a first lens focal point;
- a secondary lens disposed in a recess proximate and spaced from said primary lens transparent to the radiation to be sensed, the secondary lens having a secondary lens focal point;
- and
- an air gap between said primary lens and said secondary lens.
A radiation sensor device having a plurality of lenses, each lens having a focal point, the device comprising:
- an integrated circuit chip including a radiation sensor on a surface of the integrated chip and leads configured to provide a connection to an active surface of the integrated circuit chip and for mounting the integrated circuit chip on leads and/or a circuit board;
- one or more electrical connections configured to connect between an active surface of the integrated circuit chip and a lead frame;
- a cap attached to said integrated circuit chip spaced from and covering said radiation sensor, the cap having a transparent portion defining a primary lens transparent to the radiation to be sensed;
- an encapsulant for encapsulating said cap and said integrated circuit chip with said radiation sensor having said primary lens exposed at a boundary of said encapsulant;
- a secondary lens disposed in a recess proximate and spaced from said primary lens transparent to the radiation to be sensed;
- and
- an air gap between said primary lens and said secondary lens.
A method for forming a radiation sensor device comprising:
- attaching a cap to an integrated circuit chip having a radiation sensor thereon and electrical connections coupled to a lead frame, the cap spaced from and covering said radiation sensor and having a primary lens for receiving radiation, the primary lens having a first lens focal point;
- placing said cap and said integrated circuit chip coupled to said lead frame in a bottom mold plate of a mold;
- applying a stretch film over a top mold plate having one or more protrusions for defining a recess for a secondary lens and a recess for an air gap;
- securing said top mold plate to said bottom mold plate;
- injecting an encapsulant into the secured top mold plate and bottom mold plate;
- removing the top plate with the thin plate thereon from the bottom mold plate;
- attaching a secondary lens to the recess for the secondary lens, the secondary lens having a secondary lens focal point;
- and
- removing said cap and said integrated chip having a radiation sensor thereon and electrical connections coupled to said lead frame and said secondary lens attached thereto from the bottom mold plate.
A method for forming a radiation sensor device having a plurality of lenses, each lens having a focal point, the method comprising:
- attaching a cap to an integrated circuit chip having a radiation sensor thereon and electrical connections coupled to a lead frame, the cap spaced from and covering said radiation sensor and having a primary lens for receiving radiation;
- placing said cap and said integrated circuit chip coupled to said lead frame in a bottom mold plate of a mold;
- securing a top mold plate having one or more protrusions for defining a recess for a secondary lens and a recess for an air gap to said bottom mold plate;
- injecting an encapsulant into the secured top mold plate and bottom mold plate;
- removing the top plate with the thin plate thereon from the bottom mold plate;
- attaching a secondary lens to the recess for the secondary lens;
- and
- removing said cap and said integrated chip having a radiation sensor thereon and electrical connections coupled to said lead frame and said secondary lens attached thereto from the bottom mold plate.
Dependencies are inferred from the claim text.