Laser systems and methods using triangular-shaped tailored laser pulses for selected target classes
AssigneeElectro Scientific Industries, Inc.
InventorsBong H. Cho, Brian L. Pugh, Andrew Hooper
Life of this patent
Estimating the term…
Loading patent…
AssigneeElectro Scientific Industries, Inc.
InventorsBong H. Cho, Brian L. Pugh, Andrew Hooper
Estimating the term…
Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. At least one of the predefined temporal pulse profiles may be triangular. The target class may include, for example unpassivated electrically conductive links or other bare metal structures. Based on the target class associated with the selected target, a laser pulse is generated having a triangular temporal pulse profile. The generated laser pulse is used to process the selected structure.
A method for processing a workpiece with a laser, the method comprising:
A laser processing system for processing a workpiece, the system comprising:
A method for processing unpassivated electrically conductive link structures of a semiconductor device, each unpassivated electrically conductive link structure including bottom and top surfaces, the bottom surfaces being positioned adjacent a passivation layer or semiconductor substrate, and the top surfaces being bare so as to allow direct illumination by laser pulses during laser processing, the method comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Stabilisation of laser output parameters, e.g. frequency or amplitude: feedback control systems
By direct control of the laser beam: by shaping pulses
Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or…
Fuses, i.e. interconnections changeable from conductive to non-conductive: changeable by the use of an external beam, e.g. laser beam or ion beam
About 2 years 8 months of term left · ends 20 Jun 2029 (estimated)
This disclosure relates to laser processing systems. In particular, this disclosure relates to laser systems and methods for severing electrically conductive links and/or micromachining semiconductor devices with laser pulses having shaped temporal profiles.
Laser processing systems employed for processing dynamic random access memory (DRAM) and other semiconductor devices commonly use a Q-switched diode pumped solid state laser. When processing memory devices, for example, a single laser pulse is commonly employed to sever an electrically conductive link structure. In other industrial applications, laser scribing is used to remove metal and dielectric semiconductor materials from a semiconductor device wafer prior to dicing. Lasers may also be used, for example, to trim resistance values of discrete and embedded components.
Some laser processing systems use different operating modes to perform different functions. For example, the ESI Model 9830 available from Electro Scientific Industries, Inc. of Portland, Oreg., the assignee of the present patent application, uses a diode pumped Q-switched neodymium-doped yttrium vandate (Nd:YVO4) laser operating at a pulse repetition frequency of approximately 50 kHz for laser processing of semiconductor memory and related devices. This laser system provides a pulsed laser output for processing link structures and a continuous wave (CW) laser output for scanning beam-to-work targets. As another example, the ESI Model 9835, also available from Electro Scientific Industries, Inc., uses a diode pumped Q-switched, frequency-tripled Nd:YVO4 laser for laser processing semiconductor memory and related devices. This laser system uses a first pulsed laser output at a PRF of approximately 50 kHz for processing link structures and a second pulsed laser output at a PRF of approximately 90 kHz for scanning beam-to-work targets. In some systems, higher PRFs (e.g., approximately 100 kHz) are also possible. Generally, the pulse widths of laser pulses generated by such laser systems are functionally dependent on the PRF selected and are not independently adjustable based on differences between target structures or other process variables.
FIGS. 1A and 1B are example temporal pulse shapes of laser pulses generated by typical solid state lasers.
FIGS. 2A, 2B, 2C, and 2D are cross-sectional block diagrams of a semiconductor device that includes passivated electrically conductive link structures.
FIG. 3 is an electron micrograph showing unpassivated link structures having an area where adjacent links have melted together during laser processing using a Gaussian-shaped pulse.
This disclosure describes processing unpassivated electrically conductive link structures and other structures on semiconductor devices using laser pulses with triangular-shaped temporal pulse profiles (e.g., power vs. time). As discussed in detail below, a “triangular-shaped” temporal pulse profile includes a profile having equal rise and fall times (e.g., symmetrical triangle shape), as well as sawtooth-shaped temporal pulse profiles where the rise time does not equal the fall time (e.g., an asymmetrical triangle shape). Thus, for an asymmetrical (sawtooth) triangular-shaped temporal pulse profile, the pulse's maximum peak power is located somewhere other than at the center (in time) of the pulse.
In certain embodiments, laser pulses having triangular-shaped temporal pulse profiles may be generated using, for example, the lasers and systems described in U.S. Pat. No. 7,348,516, which is assigned to the assignee of the present patent application, and which is hereby incorporated herein in its entirety. Other example laser system embodiments for generating tailored laser pulses with triangular-shaped temporal pulse profiles are described below.
In certain embodiments, families or classes of temporal pulse profiles may be defined for different types of target structures. For symmetrical triangle shapes, families of pulse shapes can be generated by maintaining a constant pulse duration (e.g., temporal width) while increasing or decreasing the maximum peak value. Additional families for the symmetrical triangle shape may be created, for example, by using different pulse durations while maintaining, increasing, or decreasing the maximum peak value. For asymmetrical triangle shapes, families of pulse shapes may be generated by changing pulse durations and/or maximum peak values. Additional families for the asymmetrical triangle shape may be created by, for example, moving the time of the maximum peak value and/or changing the rise and/or fall times.