Multi-layer substrate
AssigneeNEC Corporation
InventorTaras Kushta
Life of this patent
Estimating the term…
Abstract
A multi-layer substrate includes a planar transmission line structure and a signal via, which are connected by a multi-tier transition. The multi-tier transition includes a signal via pad configured to serve for a full-value connection of the signal via and the planar transmission line; and a dummy pad connected to the signal via, formed in an area of a clearance hole in a conductor layer disposed between a signal terminal of the signal via and the planar transmission line, and isolated from the conductor layer.
Claims4
A multi-layer substrate comprising a planar transmission line and a signal via, wherein said planar transmission line and said signal via are connected by a multi-tier transition comprising:
- a signal via pad used for a full-value connection of said signal via and said planar transmission line;
- an another signal via pad connected to said signal via and disposed at a conductor layer which is nearest to said signal via pad between a signal terminal of said signal via and said signal via pad;
- and
- a dummy pad connected to said another signal via pad, formed in an area of a clearance hole at said conductor layer and isolated from said conductor layer,
- wherein said dummy pad comprises a form covering an area around a strip segment of said planar transmission line disposed in said area of said clearance hole and providing a coupling to said strip segment connecting said signal via pad and said planar transmission line and said form does not comprise a conductive part in a side of said clearance hole which is opposite to said strip segment.
Dependencies are inferred from the claim text.