Multilayered printed wiring board and method for manufacturing the same

A multilayered printed wiring board, comprising:

• a flexible wiring board with wiring layers on both main surfaces thereof;
• a rigid wiring board with wiring layers on both main surfaces thereof;
• a first insulating layer sandwiched between said flexible wiring board and said rigid wiring board;
• a first interlayer connection conductor disposed through said first insulating layer so as to electrically connect said flexible wiring board and said rigid wiring board under the condition that a forefront of said first interlayer connection conductor is plastically deformed through the connection for said rigid wiring board and a bottom of said first interlayer connection conductor is connected with a connection land of said wiring layer of said flexible wiring board;
• and
• an electric/electronic component embedded in said rigid wiring board,
• wherein said rigid wiring board comprises:
• a first rigid board to mount said electric/electronic component on a main surface thereof;
• a second rigid board disposed opposite to said main surface of said first rigid board on which said electric/electronic component is mounted under the condition that a roll off to house said electric/electronic component is formed as a through-hole at said second rigid board;
• a second insulating layer disposed between said first rigid board and said second rigid board and surrounding said electric/electronic component so as to embed said roll off;
• and
• a second interlayer connection conductor disposed through said second insulating layer under the condition that a diameter of said second interlayer connection conductor in the side of said first rigid board is set smaller than a diameter of said second interlayer connection conductor in the side of said second rigid board,
• wherein said second rigid board of said rigid wiring board is connected with said flexible wiring board via said first insulating layer.