Multilayer printed board and method for manufacturing the same

A multilayer printed board comprising:

• a plurality of single-sided conductor pattern films, each of the single-sided conductor pattern films having a conductor pattern formed on one surface of a resin film having a through hole and a filled through hole that is the through hole filled with a conductor integrally with the conductor pattern, the single-sided conductor pattern films being stacked one on another in such a manner that respective tops of the single-sided conductor pattern films are oriented in a same manner, and conductor patterns of the single-sided conductor pattern films being electrically connected to each other via filled through holes;
• and
• a conductive member provided between the conductor pattern and the filled through hole that oppose between each adjacent two of the single-sided conductor pattern films, the conductive member being metal-to-metal connected to the conductor pattern and the filled through hole, wherein
• the conductor pattern and the filled through hole have a base metal layer and a conductor formed on the base metal layer, the conductor pattern being formed in the conductor,
• the base metal layer is made of Ni-P alloy containing P at 2 to 6% and having a thickness of 0.05 to 0.5 micrometers, and the conductor is made of Cu, and
• the base metal layer is formed of plated Ni-P alloy that is heated at a temperature in a range of 230 to 250° C. for 30 seconds to 30 minutes.