Multilayer flexible printed circuit board and electronic device
AssigneePanasonic Corporation
InventorsNaofumi Kitano, Tetsuya Esaki
Life of this patent
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Abstract
A multilayer flexible printed circuit board disclosed in the present application is a multilayer flexible printed circuit board in which a ground layer, an insulating layer and a signal wiring layer in which signal wiring is formed are laminated in sequence, with the multilayer flexible printed circuit board including a protruding portion protruding laterally, and a ground that is electrically connected to the ground layer being formed on at least one surface of the protruding portion, in order to have shielding properties that can cope with high speed signal transmission performed via the signal wiring layer.
Claims3
An electronic device, comprising:
- a housing having an inner surface, wherein at least a portion of the inner surface is conductive;
- and
- a multilayer flexible printed circuit board comprising:
- a ground layer, an insulating layer, and a signal wiring layer in which signal wiring is formed, wherein the ground layer, the insulating layer, and the signal wiring layer are laminated in sequence, and
- a protruding portion protruding laterally, a ground that is electrically continuous to the ground layer is formed on at least one surface of the protruding portion, and the ground is electrically connected to the conductive portion of the housing,
- wherein the multilayer flexible printed circuit board is attached to the inner surface of the housing with a conductive tape, and
- the ground and the conductive portion of the housing are covered with an adhesive side of the conductive tape.
Dependencies are inferred from the claim text.