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US 8,476,531 B2Granted
Flex-rigid wiring board and method of manufacturing the same
AssigneeIbiden Co., Ltd.
InventorsMichimasa Takahashi, Masakazu Aoyama
Life of this patent
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Abstract
A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.
Claims10
A flex-rigid wiring board comprising:
- a flexible board comprising a flexible substrate and at least one conductor pattern formed over the flexible substrate;
- a non-flexible substrate disposed adjacent to the flexible board;
- an insulating layer covering the flexible board and the non-flexible substrate and exposing at least one portion of the flexible board;
- a conductor pattern formed on the insulating layer;
- and
- at least one via formed in the insulating layer and connecting the conductor pattern on the insulating layer and the conductor pattern of the flexible board,
- wherein the at least one via comprises a plurality of vias, the at least one conductor pattern comprises a plurality of conductor patterns formed over the flexible substrate, the flexible substrate has a plurality of connection pads positioned to be connected to the vias, the connection pads have a pitch larger than a pitch of the conductor patterns formed over the flexible substrate, and the conductor patterns are electrically connected to the connection pads and formed such that the pitch of the conductor patterns increases toward the connection pads.
4 more elements
A flex-rigid wiring board comprising:
- a flexible board comprising a flexible substrate and at least one conductor pattern formed over the flexible substrate;
- a non-flexible substrate disposed adjacent to the flexible board;
- an insulating layer covering the flexible board and the non-flexible substrate and exposing at least one portion of the flexible board;
- a conductor pattern formed on the insulating layer;
- at least one via formed in the insulating layer and connecting the conductor pattern on the insulating layer and the conductor pattern of the flexible board;
- an upper insulating layer formed on the insulating layer;
- and
- an upper conductor pattern formed on the upper insulating layer,
- wherein the conductor pattern on the insulating layer is connected to the upper layer conductor pattern through an upper via formed in the upper insulating layer, and the insulating layer has an end portion which faces the flexible substrate and projects beyond an end portion of the upper insulating layer, which faces the flexible substrate.
6 more elements
A flex-rigid wiring board comprising:
- a flexible board comprising a flexible substrate and a conductor pattern formed over the flexible substrate;
- a non-flexible substrate disposed adjacent to the flexible board;
- an insulating layer covering the flexible board and the non-flexible substrate and exposing at least one portion of the flexible board;
- a conductor pattern formed on the insulating layer;
- and
- a via formed in the insulating layer and connecting the conductor pattern on the insulating layer and the conductor pattern of the flexible board,
- wherein the flexible board further comprises a protective layer covering the conductor pattern of the flexible board, the via formed in the insulating layer comprises a plating layer, and the flexible board further comprises an insulating film formed on the conductor pattern and an electromagnetic shield layer formed on the insulating film.
4 more elements
Dependencies are inferred from the claim text.