Integrated circuit packaging system with vertical interconnects and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsJinGwan Kim, Hyunil Bae
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base carrier having a base carrier hole from a base carrier interconnection side to a base carrier device side; mounting a base integrated circuit over the base carrier; forming an encapsulation over the base carrier covering the base integrated circuit, the encapsulation having an encapsulation top side and having an encapsulation hole directly over the base carrier hole; and forming an interconnection structure as a single integral structure through the base carrier hole and the encapsulation hole, the interconnection structure directly on the encapsulation top side and directly on the base carrier interconnection side.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a base carrier having a base carrier hole from a base carrier interconnection side to a base carrier device side;
- mounting a base integrated circuit over the base carrier;
- forming an encapsulation over the base carrier covering the base integrated circuit, the encapsulation having an encapsulation top side and having an encapsulation hole directly over the base carrier hole;
- and
- forming an interconnection structure as a single integral structure through the base carrier hole and the encapsulation hole, the interconnection structure directly on the encapsulation top side and directly on the base carrier interconnection side.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a base carrier having a base carrier hole from a base carrier interconnection side to a base carrier device side;
- mounting a base integrated circuit over the base carrier;
- attaching a base attach layer to the base integrated circuit and the base carrier;
- forming an encapsulation over the base carrier covering the base integrated circuit, the encapsulation having an encapsulation top side and having an encapsulation hole directly over the base carrier hole;
- and
- forming an interconnection structure as a single integral structure through the base carrier hole and the encapsulation hole, the interconnection structure directly on the encapsulation top side and directly on the base carrier interconnection side.
An integrated circuit packaging system comprising:
- a base carrier having a base carrier hole from a base carrier interconnection side to a base carrier device side;
- a base integrated circuit over the base carrier;
- an encapsulation over the base carrier covering the base integrated circuit, the encapsulation having an encapsulation top side and having an encapsulation hole directly over the base carrier hole;
- and
- an interconnection structure as a single integral structure through the base carrier hole and the encapsulation hole, the interconnection structure directly on the encapsulation top side and directly on the base carrier interconnection side.
Dependencies are inferred from the claim text.