Housing for an optoelectronic component, optoelectronic component, and method for producing a housing for an optoelectronic component
AssigneeOSRAM Opto Semiconductors GmbH
InventorGeorg Bogner
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Abstract
A method for making a housing for an optoelectronic component is disclosed. The housing has a plastic base body that has a front side with an assembly region for at least one radiation emitting or radiation detecting body. The plastic base body is formed from at least one first plastic component and at least one second plastic component. The second plastic component is disposed on the front side of the plastic base body, and is formed from a material that differs from the first plastic component in at least one optical property, and forms an optically functional region of the plastic base body.
Claims8
A method for producing a housing for an optoelectronic component, the method comprising:
- forming a plastic base body by performing a two-component injection method that comprises:
- in a first step, forming a supporting part of the plastic base body from a first plastic component, wherein the plastic base body includes a front side with an assembly region for mounting at least one radiation emitting or radiation detecting body, and
- in a further step, forming an optically functional region of the plastic base body from a second plastic component that differs from the first plastic component in at least one optical property, wherein the assembly region is disposed in a reflector-like cavity of the plastic base body, wherein the second plastic component comprises a non-reflective material that is colored black, and the second plastic component comprises a layer that extends along at least a portion of the front side of the plastic base body except for the reflector-like cavity, and the layer also runs along at least a partial area of sidewall surfaces of the reflector-like cavity.
Dependencies are inferred from the claim text.