Integrated circuit packaging system with intra substrate die and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsNamJu Cho, HeeJo Chi, HanGil Shin
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a through hole; mounting an integrated circuit in the through hole, the integrated circuit having an inactive side and a vertical side; connecting a first interconnect in direct contact with the integrated circuit and the substrate; applying a wire-in-film adhesive around and above the integrated circuit leaving a portion of the vertical side and the inactive side exposed and covering a portion of the first interconnect; and mounting a chip above the integrated circuit and in direct contact with the wire-in-film adhesive.
Claims10
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate having a through hole;
- mounting an integrated circuit in the through hole, the integrated circuit having an inactive side and a vertical side;
- connecting a first interconnect in direct contact with the integrated circuit and the substrate;
- applying a wire-in-film adhesive around and above the integrated circuit leaving a portion of the vertical side and the inactive side exposed and covering a portion of the first interconnect;
- and
- mounting a chip above the integrated circuit and in direct contact with the wire-in-film adhesive.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate having a through hole;
- mounting the substrate to a coverlay tape;
- mounting an integrated circuit in the through hole and to the coverlay tape, the integrated circuit having an inactive side and a vertical side;
- connecting a bond wire in direct contact with the integrated circuit and the substrate;
- applying a wire-in-film adhesive around and above the integrated circuit leaving a portion of the vertical side and the inactive side exposed and covering a portion of the bond wire;
- mounting a chip above the integrated circuit and in direct contact with the wire-in-film adhesive;
- encapsulating the chip with an encapsulation above the substrate;
- and
- mounting external interconnects below the substrate.
Dependencies are inferred from the claim text.