Semiconductor workpiece carriers and methods for processing semiconductor workpieces
AssigneeMicron Technology, Inc.
InventorsChee Peng Neo, Hong Hak Teo, Jamilon Bin Sukami
Life of this patent
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Abstract
Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support structure having an opening sized to receive at least a portion of a semiconductor workpiece, and (b) a replaceable carrier positioned at the opening. The replaceable carrier includes a base and an adhesive layer on the base. The base has a surface, and the adhesive layer covers only a section of the surface of the base. The adhesive layer releasably attaches the replaceable carrier to the support structure.
Claims18
A method for processing microelectronic dies, the method comprising:
- attaching an adhesive of a replaceable carrier to a support structure having an opening, wherein the replaceable carrier includes a base having a surface with a first portion and a second portion, the adhesive being on the first portion of the surface and the second portion of the surface being exposed from the adhesive, wherein the base is not comprised of an adhesive;
- and
- releasably connecting a die to the second portion of the surface of the base with the die positioned at least partially in the opening of the support structure and spaced laterally apart from the adhesive.
A method for processing semiconductor components, the method comprising:
- covering at least a portion of a surface of a semiconductor component including a die with a first adhesive;
- and
- releasably attaching the component to a flexible carrier with the first adhesive directly contacting a first portion of a base of the carrier, wherein the carrier further comprises a second adhesive on only a second portion of the base apart from the first portion, wherein the first portion does not include any adhesive where the first portion contacts the component, and wherein the first adhesive is applied to the surface of the component before the semiconductor component is releasably attached to the carrier.
A method for processing semiconductor components, the method comprising:
- attaching a replaceable carrier to a support structure having an opening, the replaceable carrier having a base with a peripheral portion and a central portion, wherein the peripheral portion is attached to the support structure via an adhesive, and wherein the central portion is generally aligned with the opening of the support structure and includes an exposed surface free from any adhesives;
- and
- releasably attaching a semiconductor component to the exposed surface of the central portion of the base of the replaceable carrier.
Dependencies are inferred from the claim text.