Method forming a semiconductor light emitting device with perforations formed within

A method for manufacturing a light emitting diode package, comprising:

• perforating at least two through holes in a board body made of a thermally conductive metal;
• forming insulating oxidation layers in predetermined areas of the board body, which are adjacent to upper and lower ends of the through holes, and inner wall surfaces of the through holes, respectively;
• forming first conductive patterns on the insulating oxidation layers to be electrically insulated from the board body,
• forming second conductive patterns on the board body between the first conductive patterns to be disposed at a predetermined distance therefrom, so that the second conductive patterns are electrically isolated from the first conductive patterns;
• disposing light emitting diodes on the second conductive patterns between the through holes, respectively, and electrically connecting the light emitting diodes with the first conductive patterns;
• coating a transparent resin to cover the light emitting diodes;
• and
• cutting the board body to separate the light emitting diodes into each unit.