Methods for fabricating sensor device package using a sealing structure
AssigneeFreescale Semiconductor, Inc.
InventorsStephen R. Hooper, Dwight L. Daniels, James D. MacDonald, William G. McDonald, Chunlin C. Xia
Life of this patent
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Abstract
Fabrication methods are provided for a sensor device packages. An exemplary fabrication method involves bonding a sensor structure and another structure using a sealing structure. The sealing structure surrounds a diaphragm region of the sensor structure and provides an airtight seal between the sensor structure and the other structure to establish a fixed reference pressure on one side of the diaphragm region.
Claims19
A method of fabricating a sensor device including a sensor structure having a diaphragm region, the method comprising:
- bonding the sensor structure and a first structure using a sealing structure, wherein the sealing structure surrounds the diaphragm region and provides an airtight seal between the sensor structure and the first structure to establish a fixed reference pressure on a first side of the diaphragm region;
- and
- forming a molding compound surrounding the sensor structure and the first structure, a second side of the diaphragm region being exposed to an ambient pressure, wherein the molding compound is disposed between the sensor structure and the first structure and surrounds the sealing structure.
A method for fabricating a sensor device, the method comprising:
- forming a metal material on one of a sensor structure or a first structure;
- bonding the metal material to an other of the sensor structure or the first structure, wherein the metal material provides an airtight seal between the sensor structure and the first structure to establish a fixed pressure on a topside of a diaphragm region of the sensor structure, wherein a backside of the sensor structure includes a cavity;
- affixing the backside of the sensor structure to a frame structure having an opening aligned with the diaphragm region after bonding the metal material to the first structure, the opening exposing the cavity to an ambient pressure;
- and
- forming a molding compound overlying the sensor structure and the first structure after affixing the backside of the sensor structure to the frame structure.
A method of fabricating a sensor device including a sensor structure having a diaphragm region, the method comprising:
- bonding the sensor structure and a first structure using a sealing structure, wherein the sealing structure surrounds the diaphragm region and provides an airtight seal between the sensor structure and the first structure to establish a fixed reference pressure on a first side of the diaphragm region;
- forming a molding compound surrounding the sensor structure and the first structure, wherein a second side of the diaphragm region is exposed to an ambient pressure;
- and
- forming a layer of protective material on the second side of the sensor structure after forming the molding compound, the second side of the sensor structure including a cavity.
A method of fabricating a sensor device including a sensor structure having a diaphragm region and a cavity, the method comprising:
- bonding a first side of the sensor structure and a first structure having an opening aligned with the diaphragm region to expose the first side of the diaphragm region opposite the cavity to an ambient pressure using a sealing structure that surrounds the diaphragm region and provides an airtight seal between the sensor structure and the first structure on the first side of the diaphragm region;
- and
- bonding a capping member covering a second side of the sensor structure to the first structure after bonding the first side of the sensor structure and the first structure to establish a fixed reference pressure on the second side of the diaphragm region opposite the first side, the second side of the sensor structure including the cavity.
Dependencies are inferred from the claim text.