Photosensitive resin composition

A photosensitive resin composition comprising the following components (a) to (d):

• (a) 100 parts by weight of a polyorganosiloxane obtained by a method of combining at least one silanol compound represented by the following formula (1):
• [Chemical Formula 1]
• R12Si(OH)2 (1)
• {wherein the multiple R1 groups each independently represent a C6-18 organic group containing at least one aromatic group),
• at least one alkoxysilane compound represented by the following formula (2):
• [Chemical Formula 2]
• R2aR3bSi(OR4)4-a-b (2)
• {wherein R2 is a C2-17 organic group containing at least one group selected from the group consisting of epoxy and carbon-carbon double bond groups, when multiple R2 groups are present they may be the same or different, R3 and R4 each independently represent methyl or ethyl, a is an integer of 1 or 2, b is an integer of 0 or 1, and a+b is no greater than 2}
• and a catalyst, and polymerizing them without active addition of water;
• (b) 1-50 parts by weight of a photopolymerization initiator;
• (c) 40-600 parts by weight of a fluorene compound represented by the following formula (3):
• {wherein R5 and R6 each independently represent a C2-4 alkylene group, R7 and R8 each independently represent hydrogen or methyl, c and d are integers with c+d=0-24, and they may be the same or different, and the fluorene skeleton is optionally substituted with C1-28};
• and
• (d) 20-300 parts by weight of a compound other than component (c), having one or two (meth)acryloyl groups in the molecule.