Compositions and methods for creating electronic circuitry

A printed circuit board precursor comprising:

• a. a strippable cover layer composition comprising:
• i. 80 to 100 weight % of a strippable cover layer matrix material selected from the group consisting of chitosan, methylglycol chitosan, chitosan oligosaccharide lactate, glycol chitosan, poly(vinyl imidazole), polyallylamine, polyvinylamine, polyetheramine, cyclen(cyclic polyamine), polyethylene amine (linear, or branched, or benzylated), poly(N-methylvinylamine), polyoxyethylene bis(amine), N′-(4-Benzyloxy) -N,N-dimethylformamidine polymer-bound (amidine resin), poly(ethylene glycol) bis (2-aminoethyl), poly(2-vinylpyridine), poly(4-vinylpyridine), poly(2-vinylpyridine N-oxide), poly(4-vinylpyridine N-oxide), poly(4-vinylpyridine-co-divinylbenzene), poly(2-vinylpyridine-co-styrene), poly(4-vinylpyridine-co-styrene), poly(4-vinylpyridine)-2% crosslinked, poly(4-aminostyrene), poly(aminomethyl)polystyrene, poly(dimethylaminoethylmethacrylate), polybuytlaminoethylmethacrylate, poly(dimethylaminoethylmethacrylate), poly(aminoethylmethacrylate), copolymer of styrene and dimethylaminopropylamine maleimide and mixtures thereof;
• ii. 0 to 20 weight % of a laser dye;
• b. an insulating substrate comprising:
• i. 40 to 97 weight % of an insulating matrix material selected from polyimide, glass fiber reinforced epoxy, phenol-formaldehyde, epoxy resin, silica filled epoxy, bismaleimide resin, bismaleimide triazine, fluoropolymer, polyester, polyphenylene oxide/polyphenylene ether resin, polybutadiene/polyisoprene crosslinkable resin and copolymers, liquid crystal polymer, polyamide, cyanate ester, or any combination thereof;
• ii. 3 to 60 weight % of a metal oxide activatable filler;
• the filler is represented by the general formula:
• AB2O4
• where A is a metal cation having a valence 2, and is selected from the group consisting of cadmium, chromium, manganese, nickel, zinc, copper, cobalt, iron, magnesium, tin, titanium, and combinations of two or more of these, and where B is a metal cation having a valence of 3, and is selected from the group consisting of chromium, iron, aluminum, nickel, manganese, tin, and combinations of two or more of these, and where O is oxygen;
• the metal cation A provides the primary cation component of a first metal oxide cluster having a tetrahedral structure;
• and the metal cation B provides the primary cation component of a second metal oxide cluster having an octahedral structure;
• iii. 0 to 20 weight % of a laser dye;
• and
• c. one or more plated pattern elements in the insulating substrate.

A printed circuit board precursor comprising:

• a. a strippable cover layer composition consisting essentially thereof:
• i. 80 to 100 weight % of a strippable cover layer matrix material selected from the group consisting of chitosan, methylglycol chitosan, chitosan oligosaccharide lactate, glycol chitosan, poly(vinyl imidazole), polyallylamine, polyvinylamine, polyetheramine, cyclen(cyclic polyamine), polyethylene amine (linear, or branched, or benzylated), poly(N-methylvinylamine), polyoxyethylene bis(amine), N′-(4-Benzyloxy) -N,N-dimethylformamidine polymer-bound (amidine resin), poly(ethylene glycol) bis (2-aminoethyl), poly(2-vinylpyridine), poly(4-vinylpyridine), poly(2-vinylpyridine N-oxide), poly(4-vinylpyridine N-oxide), poly(4-vinylpyridine-co-divinylbenzene), poly(2-vinylpyridine-co-styrene), poly(4-vinylpyridine-co-styrene), poly(4-vinylpyridine)-2% crosslinked, poly(4-aminostyrene), poly(aminomethyl)polystyrene, poly(dimethylaminoethylmethacrylate), polybuytlaminoethylmethacrylate, poly(dimethylaminoethylmethacrylate), poly(aminoethylmethacrylate), copolymer of styrene and dimethylaminopropylamine maleimide and mixtures thereof;
• b. an insulating substrate comprising:
• i. 40 to 97 weight % of an insulating matrix material selected from polyimide, glass fiber reinforced epoxy, phenol-formaldehyde, epoxy resin, silica filled epoxy, bismaleimide resin, bismaleimide triazine, fluoropolymer, polyester, polyphenylene oxide/polyphenylene ether resin, polybutadiene/polyisoprene crosslinkable resin and copolymers, liquid crystal polymer, polyamide, cyanate ester, or any combination thereof;
• i. 3 to 60 weight % of a metal oxide activatable filler;
• the filler is represented by the general formula:
• AB2O4
• where A is a metal cation having a valence 2, and is selected from the group consisting of cadmium, chromium, manganese, nickel, zinc, copper, cobalt, iron, magnesium, tin, titanium, and combinations of two or more of these, and where B is a metal cation having a valence of 3, and is selected from the group consisting of chromium, iron, aluminum, nickel, manganese, tin, and combinations of two or more of these, and where O is oxygen;
• the metal cation A provides the primary cation component of a first metal oxide cluster having a tetrahedral structure;
• and the metal cation B provides the primary cation component of a second metal oxide cluster having an octahedral structure.

A printed circuit board precursor comprising:

• a. a strippable cover layer composition consisting essentially thereof:
• i. 80 to 100 weight % of a strippable cover layer matrix material selected from the group consisting of chitosan, methylglycol chitosan, chitosan oligosaccharide lactate, glycol chitosan, poly(vinyl imidazole), polyallylamine, polyvinylamine, polyetheramine, cyclen(cyclic polyamine), polyethylene amine (linear, or branched, or benzylated), poly(N-methylvinylamine), polyoxyethylene bis(amine), N′-(4-Benzyloxy) -N,N-dimethylformamidine polymer-bound (amidine resin), poly(ethylene glycol) bis (2-aminoethyl), poly(2-vinylpyridine), poly(4-vinylpyridine), poly(2-vinylpyridine N-oxide), poly(4-vinylpyridine N-oxide), poly(4-vinylpyridine-co-divinylbenzene), poly(2-vinylpyridine-co-styrene), poly(4-vinylpyridine-co-styrene), poly(4-vinylpyridine)-2% crosslinked, poly(4-aminostyrene), poly(aminomethyl)polystyrene, poly(dimethylaminoethylmethacrylate), polybuytlaminoethylmethacrylate, poly(dimethylaminoethylmethacrylate), poly(aminoethylmethacrylate), copolymer of styrene and dimethylaminopropylamine maleimide and mixtures thereof;
• b. an insulating substrate comprising:
• i. 40 to 97 weight % of an insulating matrix material selected from polyimide, glass fiber reinforced epoxy, phenol-formaldehyde, epoxy resin, silica filled epoxy, bismaleimide resin, bismaleimide triazine, fluoropolymer, polyester, polyphenylene oxide/polyphenylene ether resin, polybutadiene/polyisoprene crosslinkable resin and copolymers, liquid crystal polymer, polyamide, cyanate ester, or any combination thereof;
• ii. 3 to 60 weight % of a metal oxide activatable filler;
• the filler is represented by the general formula:
• AB2O4
• where A is a metal cation having a valence 2, and is selected from the group consisting of cadmium, chromium, manganese, nickel, zinc, copper, cobalt, iron, magnesium, tin, titanium, and combinations of two or more of these, and where B is a metal cation having a valence of 3, and is selected from the group consisting of chromium, iron, aluminum, nickel, manganese, tin, and combinations of two or more of these, and where O is oxygen;
• the metal cation A provides the primary cation component of a first metal oxide cluster having a tetrahedral structure;
• and the metal cation B provides the primary cation component of a second metal oxide cluster having an octahedral structure;
• c. one or more plated pattern elements in the insulating substrate.