Embossed release paper and process for producing the same
AssigneeDai Nippon Printing Co., Ltd.
InventorsNoriyuki Shiina, Kyoko Kogo
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Abstract
This invention provides an embossed release paper that has high heat resistance and embossing properties. The embossed release paper comprises a paper base material, an ionizing radiation-cured resin layer, and a heat-cured silicone layer stacked in that order, the embossed release paper having embosses. The embossed release paper has high heat resistance and thus is suitable for use in synthetic leather production and melamine decorative sheet production that involve surface emboss pattern formation.
Claims11
A embossed release paper comprising a paper base material, an ionizing radiation-cured resin layer, and a heat-cured silicone layer stacked in that order, the embossed release paper having embosses, the ionizing radiation-cured resin layer being formed by curing an ionizing radiation-curable composition selected from the group consisting of a (meth)acryloyl group-containing acrylic copolymer (I) and (II),
- wherein the (meth)acryloyl group-containing acrylic copolymer (I) is a copolymer produced by reacting an epoxy group-containing copolymer (C) comprising (meth)acrylate monomer units (A) and epoxy group-containing (meth)acrylate monomer units (B) with (meth)acrylic acid, and
- the (meth)acryloyl group-containing acrylic copolymer (II) is a copolymer produced by reacting a copolymer comprising 35 to 80 parts by mass of a (meth)acrylic ester, 20 to 60 parts by mass of a glycidyl (meth)acrylic ester, and 0 to 30 parts by mass of another (meth)acrylic ester with 10 to 30 parts by mass of a (meth)acrylic acid.
Dependencies are inferred from the claim text.