US 8,475,872 B2 · Patterning of thin film layers

Abstract

Simplified patterning of layers of a thin film is disclosed. In some embodiments, the patterning can include patterning a first conductive layer using a patterned dielectric layer as a mask and patterning a second conductive layer using a patterned passivation layer as another mask. In other embodiments, the patterning can include patterning a first conductive layer using a removable photosensitive layer as a mask, patterning a black mask layer using a removable photo mask, and patterning a second conductive layer using a patterned passivation layer as another mask. In still other embodiments, the patterning can include patterning a first conductive layer using a patterned black mask layer as a mask and patterning a second conductive layer using a patterned passivation layer as another mask. An exemplary device utilizing the thin film so patterned can include a touch sensor panel.

Claims18

Dependent claims

A method comprising:

depositing a first conductive layer onto a surface;
patterning a dielectric layer on the first conductive layer;
patterning the first conductive layer using the patterned dielectric layer as a first mask;
depositing a second conductive layer onto the patterned dielectric layer;
patterning a passivation layer on the second conductive layer;
and
patterning the second conductive layer using the patterned passivation layer as a second mask.

4 more elements

Dependencies are inferred from the claim text.

Patterning of thin film layers

Life of this patent

Patterning of thin film layers

Life of this patent

Abstract

Claims18