Imprint device and imprint method
AssigneeKabushiki Kaisha Toshiba
InventorYohko Furutono
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Abstract
According to one embodiment, first image information of a mold is acquired by irradiating the mold with first light, the mold having an uneven pattern with a shape corresponding to a pattern to be transferred onto a substrate to be processed. The position of the uneven pattern of the mold is adjusted by applying stress to the mold. Second image information is acquired by irradiating the mold whose position is adjusted with the first light. Stress information of the mold whose position is adjusted is measured by comparing the first image information with the second image information. The position adjustment is repeated until the measurement result satisfies a desired condition, and a pattern is formed on the substrate by using the mold whose position is adjusted.
Claims7
An imprint method comprising:
- acquiring first image information of a mold by irradiating the mold with first light and receiving the first light reflecting a polarization characteristic of the mold, the mold having an uneven pattern with a shape corresponding to a pattern to be transferred onto a substrate to be processed;
- adjusting a position of the uneven pattern of the mold by applying stress to the mold;
- acquiring second image information by irradiating the mold whose position is adjusted with the first light and receiving the first light reflecting a polarization characteristic of the mold whose position is adjusted;
- measuring stress information of the mold whose position is adjusted, by comparing the first image information with the second image information;
- and
- repeating the position adjustment until the measurement result satisfies a desired condition, and forming a pattern on the substrate by using the mold whose position is adjusted.
Dependencies are inferred from the claim text.