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US 8,475,696 B2Granted
Method for packaging light emitting diode
AssigneeIndustrial Technology Research Institute
InventorsChih-hsiang Lin, Ya-Lan Chuang, Pei-Jung Tsat, Shu-Ling Yeh, Chin-Lang Wu, Cing-Jiuh Kang, Hsin-Ching Kao
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Abstract
A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode.
Claims12
A method for packaging light emitting diodes, comprising:
- providing a thermoplastic polymer material;
- drying the thermoplastic polymer material;
- providing a mold with pre-embedded light emitting diodes, the mold comprising:
- an upper part having a plurality of passages through which the high-polymer thermoplastic material is passed;
- and
- a lower part have two recesses for each of the plurality of passages, the recesses being in fluid communication with the plurality of passages, such that each of the plurality of passages is in fluid communication with two recesses;
- and
- feeding the thermoplastic polymer material into a feeding inlet of the upper part, the feeding inlet being in fluid communication with the plurality of passages;
- wherein the thermoplastic polymer material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the pre-embedded light emitting diodes.
6 more elements
A method for packaging light emitting diodes, comprising:
- providing a thermoplastic polymer material;
- drying the thermoplastic polymer material;
- feeding the thermoplastic polymer material into a feeding inlet provided in an upper part of a mold;
- flowing the thermoplastic polymer material through a plurality of passages located in the upper part and into a plurality of recesses located in a lower part of the mold, wherein the high-polymer material is flowed around a plurality of pre-embedded light emitting diodes that are providing a mold with pre-embedded light emitting diodes that are located in the recesses.
1 more element
Dependencies are inferred from the claim text.