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US 8,475,671 B2Granted
Method for local etching of the surface of a substrate
AssigneeCentre National De La Recherche Scientifique
InventorLaurent Jalabert
Life of this patent
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Abstract
The invention relates to a method for the local etching of the surface of a substrate, characterized in that it comprises: a) making a gas-pervious polymer pad that comprises three-dimensional patterns on one surface thereof; b) contacting the surface including the pad patterns with the substrate; c) submitting the pad/substrate assembly to a plasma so that the species present in the plasma are accelerated and diffused through the pad until they reach the substrate.
Claims18
A method of localized etching of surface of a substrate, the method being characterized in that it comprises:
- a) producing a pad from a gas-permeable polymer that includes raised patterns on one of its faces;
- b) bringing the face of the pad comprising the patterns into contact with the substrate;
- and
- c) subjecting the pad/substrate assembly to a plasma which, apart from the zones where the patterns of the polymeric pad are in contact with the substrate, does not come into direct contact with the surface of the substrate, such that species present in the plasma are accelerated and diffuse through the pad until they reach the substrate.
1 more element
Dependencies are inferred from the claim text.