Systems and methods for monitoring plating and etching baths
AssigneeThe Trustees of Columbia University in the City of New York
InventorsAlan C. West, Mark J. Willey, Robert J. von Gutfeld
Life of this patent
Estimating the term…
Loading patent…
AssigneeThe Trustees of Columbia University in the City of New York
InventorsAlan C. West, Mark J. Willey, Robert J. von Gutfeld
Estimating the term…
Methods and systems for monitoring electrolyte bath fluids are provided. The electrolyte bath fluids can be electroplating, electroless plating or etching solutions. The monitoring systems employ microfluidic devices, which have built in microfluidic channels and microfabricated thin-film electrodes. The devices are configured with fluid pumps to control the movement and mixing of test fluids through the microfluidic channels. The microfabricated thin-film electrodes are configured so that the plating or etching bath fluid composition can be characterized by electrochemical measurements. The monitoring methods and system provide faster measurement times, generate minimal waste, and occupy dramatically reduced physical space compared to conventional bath-monitor systems. The monitoring systems and method also provide low-cost system and methods for measuring or monitoring electroless plating bath rates.
A microfluidic system for monitoring the composition of electrolyte bath fluids, the microfluidic system comprising:
A microfluidic system for determining additive concentrations in an etching bath solution, the microfluidic system comprising:
A method of monitoring the composition of plating or etching bath fluids, the method comprising:
A method of monitoring an etching bath, the method comprising:
Dependencies are inferred from the claim text.