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US 8,475,635 B2Granted
Processes and device for the deposition of films on substrates
AssigneeCarl Zeiss SMT GmbH
InventorsAndrey E. Yakshin, Wolfgang Fukarek
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Abstract
Deposition processes and devices for the fabrication of multilayer systems to better control the energy contribution at different stages of the deposition. This is achieved by depositing films by sputtering in a scheme providing for thermalized particles. Thermalized particles are obtained by choosing the working gas pressure and the distance between target and substrate to result in a mean free path of particles smaller than the distance between target and substrate or to result in a product of pressure and distance being larger than 2.0 cmPa.
Claims8
A process for deposition of films on substrates, comprising:
- sputtering or magnetron sputtering of one layer on another layer underlying said one layer or on a substrate for fabrication of a reflective multilayer system for the extreme ultraviolet wavelength range or for the soft x-ray wavelength range,
- wherein a distance between a target and the substrate is larger than 25 cm,
- wherein during said sputtering of said one layer a working gas pressure is regulated in a first step to a first pressure value and is decreased in one subsequent step to a second pressure value lower than the first pressure value, and
- wherein for the first pressure value the mean free path of particles is smaller than the distance between the target and the substrate, and for the second pressure value the mean free path of particles is larger than the distance between the target and the substrate,
- thereby leading to a suppression of intermixing between said one layer and said other layer or the substrate for the first pressure value and enabling to control the growing film's roughness of said one layer for the second pressure value.
2 more elements
Dependencies are inferred from the claim text.