US 8,475,625 B2Granted

Apparatus for etching high aspect ratio features

AssigneeApplied Materials, Inc.

InventorsSharma Pamarthy, Huutri Dao, Xiaoping Zhou, Kelly A. McDonough, Jivko Dinev, Farid Abooameri, David E. Gutierrez, Jim Zhongyi He, Robert S. Clark, Dennis M. Koosau, Jeffrey William Dietz, Declan Scanlan, Subhash Deshmukh, John P. Holland, Alexander Paterson

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Abstract

Embodiments of the invention provide a method and apparatus, such as a processing chamber, suitable for etching high aspect ratio features. Other embodiments include a showerhead assembly for use in the processing chamber. In one embodiment, a processing chamber includes a chamber body having a showerhead assembly and substrate support disposed therein. The showerhead assembly includes at least two fluidly isolated plenums, a region transmissive to an optical metrology signal, and a plurality of gas passages formed through the showerhead assembly fluidly coupling the plenums to the interior volume of the chamber body.

Claims22

Dependent claims

A processing chamber comprising:

a chamber body assembly having an interior volume;
a showerhead assembly coupled to a ceiling of the chamber body and having at least two fluidly isolated plenums formed therein, a region transmissive to an optical metrology signal defined through a ceramic plug, a first plurality of gas passages formed through the showerhead assembly fluidly coupling a first plenum of the at least two fluidly isolated plenums to the interior volume of the chamber body, wherein the first gas passages are distributed at a plurality radial distances from a center of the showerhead assembly, and a second plurality of gas passages formed through the showerhead assembly fluidly coupling a second plenum of the at least two fluidly isolated plenums to the interior volume of the chamber body, wherein the second gas passages are distributed at a plurality radial distances from the center of the showerhead assembly, wherein the showerhead assembly further includes a gas distribution plate facing the substrate support assembly fabricated from bulk Yttrium, the gas distribution plate having a plurality of apertures aligned with a plurality of apertures formed in the ceramic plug;
and
a substrate support assembly disposed in the chamber body.

1 more element

A processing chamber comprising:

a chamber body assembly having an interior volume;
a showerhead assembly coupled to a ceiling of the chamber body and having an inner gas flow plenum and an outer gas flow plenum, the plenums being fluidly isolated, and a region transmissive to an optical metrology signal, the transmissive region comprising a ceramic plug having a plurality of apertures, the showerhead assembly further comprising a gas distribution plate having a plurality of apertures aligned with the apertures formed in the ceramic plug;
a substrate support assembly disposed in the chamber body and having at least two independently controllable laterally spaced temperature zones;
an optical metrology system arranged to view the interior volume of the chamber body through the plurality of apertures of the ceramic plug and the plurality of apertures of the gas distribution plate of the showerhead assembly;
a bias power source coupled to the substrate support assembly;
at least two plasma power sources coupled to the substrate support assembly;
a gas panel having a plurality of gas sources coupled to a mixing manifold, the mixing manifold fluidly coupled to the plenums of the showerhead assembly;
and
a least one direct injection gas source fluidly coupled to at least one of the plenums and bypassing the mixing manifold.

6 more elements

Dependencies are inferred from the claim text.