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US 8,475,612 B2Granted
Method for molecular adhesion bonding with compensation for radial misalignment
AssigneeSoitec
InventorGweltaz Gaudin
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Abstract
A method for bonding a first wafer on a second wafer by molecular adhesion, where the wafers have an initial radial misalignment between them. The method includes bringing the two wafers into contact so as to initiate the propagation of a bonding wave between the two wafers while a predefined bonding curvature is imposed on at least one of the two wafers during the contacting step as a function of the initial radial misalignment.
Claims15
A method for bonding a first wafer on a second wafer by molecular adhesion, the wafers having an initial radial misalignment between them, which method comprises:
- calculating a predefined bonding curvature as a function of the initial radial misalignment;
- and
- bringing the two wafers into contact so as to initiate the propagation of a bonding wave between the two wafers,
- wherein the predefined bonding curvature is imposed on at least one of the two wafers during the contacting step, and
- wherein calculating the predefined bonding curvature further comprises:
- measuring the initial radial misalignment between the two wafers to be compensated;
- measuring the curvature of each wafer before bonding;
- determining a compensation radial misalignment in dependence at least in part on the initial radial misalignment between the two wafers;
- calculating a post-bonding curvature capable of generating the determined compensating radial misalignment between the two wafers;
- and
- calculating the predefined bonding curvature in dependence at least in part on the calculated post-bonding curvature and the measured curvatures of each wafer.
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Dependencies are inferred from the claim text.