Substrate cleaning method and apparatus
AssigneeToyko Electron Limited
InventorsHidefumi Matsui, Tsuyoshi Moriya
Life of this patent
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Abstract
A substrate cleaning method for cleaning and removing foreign materials adhered to a surface of a substrate includes heating the substrate to peel off the foreign materials from the surface of the substrate by a thermal stress, removing the foreign materials from the surface of the substrate by a temperature gradient created in a proximity of the surface of the substrate, and collecting the foreign materials removed from the surface of the substrate by a collecting unit facing the substrate.
Claims14
A substrate cleaning method by removing foreign materials adhered to a frontside and a backside surface of a substrate which is mounted on a mounting table by using a collecting unit facing the substrate, the collecting unit including a charging plate, the method comprising:
- heating the substrate to peel off the foreign materials from the frontside surface of the substrate by a thermal stress;
- charging the charging plate to a first polarity and charging the frontside surface of the substrate to a second polarity that is opposite to the first polarity;
- removing the foreign materials from the frontside surface of the substrate by a temperature gradient created in a proximity of the frontside surface of the substrate and an electrostatic force exerted on the foreign materials;
- collecting the foreign materials removed from the frontside surface of the substrate by the collecting unit;
- lifting the substrate from a surface of the mounting table after removing the foreign materials adhered to the frontside surface of the substrate;
- and
- removing foreign materials adhered to the backside surface of the lifted substrate,
- wherein in said heating and said collecting, a pressure of an atmosphere surrounding the substrate is set to be greater than 1.3×102 Pa (1 Torr) and less than or equal to 6.6 kPa (50 Torr), and
- wherein the pressure of the atmosphere surrounding the substrate during said collecting is set to equal to that during said heating.
A substrate cleaning apparatus for removing foreign materials adhered to a frontside and a backside surface of a substrate, the apparatus comprising:
- a mounting table, on which the substrate is mounted;
- a heating unit configured to heat the substrate mounted on the mounting table to peel off the foreign materials from the frontside surface of the surface by a thermal stress and to remove the foreign materials from the frontside surface of the substrate by a thermophoretic force;
- a foreign material collecting unit, which is arranged to face the mounting table, the foreign material collecting unit being configured to collect the foreign materials removed from the frontside surface of the substrate, the foreign material collecting unit including a charging plate, the charging plate and the frontside surface of the substrate being charged to opposite polarities;
- a lifting unit configured to lift the substrate from a surface of the mounting table;
- and
- a backside cleaning device configured to remove foreign materials adhered to the backside surface of the substrate lifted by the lifting unit,
- wherein the substrate cleaning apparatus further comprises a CPU configured to set a pressure of an atmosphere surrounding the substrate to be greater than 1.3×102 Pa (1 Torr) and less than or equal to 6.6 kPa (50 Torr) during heating the substrate by using the heating unit and collecting the foreign materials removed from the substrate by using the foreign material collecting unit, and
- wherein the CPU is further configured to set the pressure of the atmosphere surrounding the substrate during said collecting equal to that during said heating.
Dependencies are inferred from the claim text.