US 8,475,056 B2Granted

Semiconductor device assembly

AssigneeJDS Uniphase Corporation

InventorsPrasad Yalamanchili, Xiangdong Qiu, Reddy Raju, Jay A. Skidmore, Michael Au, Laura Zavala, Richard L. Duesterberg

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Abstract

A fiber coupled semiconductor device having an improved optical stability with respect to temperature variation is disclosed. The stability improvement is achieved by placing the platform holding the semiconductor chip and the optical fiber onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Attaching the optical fiber to a vertical mounting surface of a fiber mount, and additionally attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

Claims17

Dependent claims

A semiconductor device assembly comprising:

a thermoelectric cooler;
a heat conducting spacer mounted on the thermoelectric cooler;
a semiconductor device subassembly including:
a platform having a bottom surface with a platform mounting area mounted on the spacer;
and
a semiconductor chip extending in a first plane, the semiconductor chip thermally coupled to the platform for removing heat from the semiconductor chip;
a fiber mount attached to the semiconductor device subassembly, the fiber mount having a fiber mounting surface;
and
an optical fiber attached to the fiber mounting surface and optically coupled to the semiconductor chip for receiving light therefrom;
wherein the platform mounting area is smaller than a total area of the bottom surface of the platform, whereby sensitivity of the optical coupling between the semiconductor chip and the optical fiber to deformation of the thermoelectric cooler is lessened.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/843,823Filed 26 Jul 2010 · us provisional application
Priority: 28 Jul 2009
Published: US 2011/0026877 A13 Feb 2011
Granted: 2 Jul 2013
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

G02B 6/423
Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements: using guiding surfaces for the alignment
H01S 5/02216
Characterised by the shape of the housings: butterfly-type, i.e. with electrode pins extending horizontally from the housings
H01S 5/02251
Out-coupling of light: using optical fibres
H01S 5/02326
Mechanically integrated components on mount members or optical micro-benches: arrangements for relative positioning of laser diodes and optical…