LED backlight module structure for increasing process yield

An Light-emitting diode (LED) backlight module structure for increasing process yield, comprising:

• a housing, having at least one circuit-disposing portion, and the circuit-disposing portion having a plurality of disposing holes;
• a circuit substrate;
• a copper circuit layer, being disposed on the surface of the circuit substrate through a thermally conductive insulating layer, wherein the copper circuit layer has at least one main circuit and a plurality of soldering point;
• a plurality of LED chips, having a plurality of soldering pins and a light-emitting surface on the bottoms and the tops thereof, wherein the plurality of LED chips are disposed on the copper circuit layer, and the soldering pins being welded to the soldering points;
• moreover, the circuit substrate being attached to the outer surface of the circuit-disposing portion via another thermally conductive insulating layer, such that the LED chips respectively pass through the disposing holes and enter the interior of the housing from the outer surface of the circuit-disposing portion;
• a plurality of solder paste overflow prevention members, being disposed between the LED chips and the copper circuit layer;
• a light guide plate, being disposed in the housing, and a light-receiving surface of the light guide plate being opposite to the light-emitting surfaces of the LED chips;
• and
• a bottom reflector, being disposed on the bottom of the light guide plate for preventing light leakage.

An Light-emitting diode (LED) backlight module structure for increasing process yield, comprising:

• a housing;
• a copper circuit layer, being disposed on the surface of a circuit-disposing portion of the housing through a thermally conductive insulating layer, wherein the copper circuit layer has at least one main circuit and a plurality of soldering point;
• a plurality of LED chips, having a plurality of soldering pins and a light-emitting surface on the bottoms and the tops thereof, wherein the plurality of LED chips are disposed on the copper circuit layer, and the soldering pins being welded to the soldering points;
• a position limiting band, being disposed on the copper circuit layer via another thermally conductive insulating layer, wherein the another thermally conductive insulating layer has a plurality of openings for exposing the soldering points of the copper circuit layer, and the position limiting band comprising:
• a plurality of position limiting holes, for receiving and fixing the LED chips;
• and
• a plurality of avoiding recesses, being formed on the bottom of the inner wall of each position limiting hole pairwise;
• a light guide plate, being disposed in the housing, and a light-receiving surface of the light guide plate being opposite to the light-emitting surfaces of the LED chips;
• and
• a bottom reflector, being disposed on the bottom of the light guide plate for preventing light leakage.

An Light-emitting diode (LED) backlight module structure for increasing process yield, comprising:

• a housing, having at least one circuit-disposing portion, and the circuit-disposing portion having a plurality of disposing holes;
• a circuit substrate;
• a copper circuit layer, being disposed on the surface of the circuit substrate through a thermally conductive insulating layer, wherein the copper circuit layer has at least one main circuit and a plurality of soldering point;
• a plurality of LED chips, having a plurality of soldering pins and a light-emitting surface on the bottoms and the tops thereof, wherein the plurality of LED chips are disposed on the copper circuit layer, and the soldering pins being welded to the soldering points;
• moreover, the circuit substrate being attached to the outer surface of the circuit-disposing portion via another thermally conductive insulating layer, such that the LED chips respectively pass through the disposing holes and enter the interior of the housing from the outer surface of the circuit-disposing portion;
• a position limiting band, being disposed on the copper circuit layer via another thermally conductive insulating layer, wherein the another thermally conductive insulating layer has a plurality of openings for exposing the soldering points of the copper circuit layer, and the position limiting band comprising:
• a plurality of position limiting holes, for receiving and fixing the LED chips;
• and
• a plurality of avoiding recesses, being formed on the bottom of the inner wall of each position limiting hole pairwise;
• a light guide plate, being disposed in the housing, and a light-receiving surface of the light guide plate being opposite to the light-emitting surfaces of the LED chips;
• and
• a bottom reflector, being disposed on the bottom of the light guide plate for preventing light leakage.