Wireless IC device
AssigneeMurata Manufacturing Co., Ltd.
InventorsNoboru Kato, Yuya Dokai
Life of this patent
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Abstract
A wireless IC device includes a wireless IC chip arranged to process a transmission/received signal, a matching inductance element and a planar electrode which are provided on the surface of a feeder circuit board formed by a flexible dielectric, and a loop-shaped radiation plate provided on the undersurface of the feeder circuit board. Both ends of the radiation plate are coupled to a resonance circuit including an inductance element by electromagnetic field coupling. The wireless IC chip is operated using a signal received by the radiation plate. A response signal transmitted from the wireless IC chip is externally transmitted from the radiation plate.
Claims14
A wireless IC device comprising:
- a wireless IC chip arranged to process a transmission/received signal, and including a first terminal and a second terminal;
- a first inductance element connected between the first terminal and the second terminal;
- a second inductance element having a loop shape;
- wherein
- a first end of the second inductance element is capacitively coupled to the first inductance element, and a second end of the second inductance element is electrically connected to one end of the first inductance element;
- the first inductance element is arranged to match impedance between the wireless IC chip and the second inductance element;
- and
- the second inductance element defines a radiator.
Dependencies are inferred from the claim text.