US 8,474,681 B1Granted

Solder apparatus

AssigneeAntaya Technologies Corporation

InventorsJohn Pereira, John P. Hendrick, Lawrence Richard Cole

Life of this patent

Estimating the term…

Abstract

An apparatus for presoldering electrical components can include a die device having a punch member for punching a solder preform from a sheet of solder, and pressing the solder preform against an electrical component. A heating device can press against the electrical component on a opposite side from the die device for sandwiching the electrical component between the punch member and the heating member, for heating the electrical component and melting the solder preform thereon.

Claims7

Dependent claims

An apparatus for presoldering electrical components comprising:

a die device comprising longitudinally positioned multiple punch locations having multiple punch members extendable within multiple respective cavities in a die member over which a ribbon of solder is extendable, through which the punch members are capable of entering and extending within for punching multiple solder preforms from the ribbon of solder and pressing the multiple solder preforms against respective multiple electrical components;
and
a heating device, the die device and the heating device capable of moving towards each other for pressing against the electrical components on opposite sides and sandwiching the electrical components for heating the electrical components and melting the solder preforms thereon, each punch member being controllably extendable to a location partway within a respective cavity of the die member to provide a consistent controlled gap with a predetermined distance between an end surface of the punch member and a sealing surface of the die member, for forming a respective mold with a mold cavity defined by the end surface of the punch member and a side wall of the cavity that extends the distance from the sealing surface of the die member to the end surface of the punch member, the sealing surface of the mold for positioning against a respective electrical component for preventing molten solder from escaping, each mold cavity being shaped and sized for forming a solder layer on a respective electrical component having a predetermined thickness and a flat nonmeniscus outer surface, and removable after solder solidification, the heating device comprising longitudinally positioned multiple spaced apart heating members movable relative to respective punch members for pressing against respective multiple electrical components and sandwiching the multiple electrical components for simultaneously heating the electrical components and melting the solder preforms thereon, the heating members are each connected to a respective actuator for independent movement of each heating member, the respective actuators capable of individually simultaneously pressing the heating members against the respective electrical components.

Dependencies are inferred from the claim text.

patentgrep

Loading patent…

Abstract

An apparatus for presoldering electrical components comprising:

a die device comprising longitudinally positioned multiple punch locations having multiple punch members extendable within multiple respective cavities in a die member over which a ribbon of solder is extendable, through which the punch members are capable of entering and extending within for punching multiple solder preforms from the ribbon of solder and pressing the multiple solder preforms against respective multiple electrical components;
and
a heating device, the die device and the heating device capable of moving towards each other for pressing against the electrical components on opposite sides and sandwiching the electrical components for heating the electrical components and melting the solder preforms thereon, each punch member being controllably extendable to a location partway within a respective cavity of the die member to provide a consistent controlled gap with a predetermined distance between an end surface of the punch member and a sealing surface of the die member, for forming a respective mold with a mold cavity defined by the end surface of the punch member and a side wall of the cavity that extends the distance from the sealing surface of the die member to the end surface of the punch member, the sealing surface of the mold for positioning against a respective electrical component for preventing molten solder from escaping, each mold cavity being shaped and sized for forming a solder layer on a respective electrical component having a predetermined thickness and a flat nonmeniscus outer surface, and removable after solder solidification, the heating device comprising longitudinally positioned multiple spaced apart heating members movable relative to respective punch members for pressing against respective multiple electrical components and sandwiching the multiple electrical components for simultaneously heating the electrical components and melting the solder preforms thereon, the heating members are each connected to a respective actuator for independent movement of each heating member, the respective actuators capable of individually simultaneously pressing the heating members against the respective electrical components.