Method and apparatus for bonded substrates

An apparatus, comprising:

• a base member having a top surface and a recessed region, the recessed region defining a sidewall substantially orthogonal to the top surface, the recessed region configured to receive at least a first substrate;
• a support member disposed over the top surface;
• and
• a pressure bar configured to cause a center portion of a second substrate to form a bonded region with the first substrate while the support member maintains a separation of a peripheral portion of the second substrate from a peripheral portion of the first substrate,
• the support member configured to move such that the separation of the peripheral portion of the first substrate from the peripheral portion of the second substrate is reduced and the bonded region between the first substrate and the second substrate is expanded radially from the center portion.

An apparatus, comprising:

• a base member having a top surface and a recessed region, the recessed region configured to receive at least a first substrate;
• a support member disposed over the top surface;
• a pressure bar configured to cause a center portion of a second substrate to form a bonded region with the first substrate while the support member maintains a separation of a peripheral portion of the second substrate from a peripheral portion of the first substrate,
• the support member configured to move such that the separation of the peripheral portion of the first substrate from the peripheral portion of the second substrate is reduced and the bonded region between the first substrate and the second substrate is expanded radially from the center portion;
• and
• a cantilever configured to move the pressure bar from a position disposed above the center portion to a position disposed above the peripheral portion of the second substrate, the pressure bar configured to apply pressure to the peripheral portion of the second substrate when the pressure bar is moved to the position disposed above the peripheral portion.

An apparatus, comprising:

• a base member having a top surface and a recessed region, the recessed region defining a sidewall and configured to receive at least a first substrate;
• a plurality of pins disposed on the top surface along a periphery of and outside of a sidewall of the recessed region;
• a support member disposed over the top surface;
• and
• a pressure bar configured to cause a center portion of a second substrate to form a bonded region with the first substrate while the support member maintains a separation of a peripheral portion of the second substrate from a peripheral portion of the first substrate,
• the support member configured to move such that the separation of the peripheral portion of the first substrate from the peripheral portion of the second substrate is reduced and the bonded region between the first substrate and the second substrate is expanded radially from the center portion.

An apparatus, comprising:

• a base member having a top surface and a recessed region, the recessed region defining a sidewall and configured to receive at least a first substrate;
• a support member disposed over the top surface;
• a pressure bar configured to cause a center portion of a second substrate to form a bonded region with the first substrate while the support member maintains a separation of a peripheral portion of the second substrate from a peripheral portion of the first substrate,
• the support member configured to move such that the separation of the peripheral portion of the first substrate from the peripheral portion of the second substrate is reduced and the bonded region between the first substrate and the second substrate is expanded radially from the center portion;
• and
• a block configured to press the second substrate against the first substrate during bonding of the second substrate to the first substrate, the block including a recess within which a heating element is disposed.