Method for fabricating printed circuit board
AssigneeSamsung Electronics Co., Ltd.
InventorsKi-Hyun Kim, Se Ho Park, Seok-Myong Kang, Young-Min Lee
Life of this patent
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Abstract
A method for fabricating a printed circuit board is provided. The method includes manufacturing a base film including a first side and a second side opposite to the first side; printing a first wiring on the first side with a high-viscosity conductive material having a viscosity of 5,000 to 300,000 centipoise (CPS); forming a via-hole that passes through both sides of the base film, and passes by the first wiring; and printing a second wiring on the second side with a low-viscosity conductive material having a viscosity of 100 to 5,000 CPS. The low-viscosity conductive material is applied to an inner wall of the via-hole to conductively connect the first wiring to the second wiring.
Claims7
A method for fabricating a printed circuit board, the method comprising:
- manufacturing a base film including a first side and a second side, the second side being opposite to the first side;
- printing a first wiring on the first side of the base film with a high-viscosity conductive material having a viscosity of 5,000 to 300,000 centipoise (CPS);
- then
- forming a via-hole that passes through both the first and second sides of the base film, and passes by the first wiring;
- and
- printing a second wiring on the second side of the base film with a low-viscosity conductive material having a viscosity of 100 to 5,000 CPS, wherein the low-viscosity conductive material is applied to an inner wall of the via-hole to conductively connect the first wiring to the second wiring.
Dependencies are inferred from the claim text.