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US 8,471,274 B2Granted
LED light disposed on a flexible substrate and connected with a printed 3D conductor
AssigneeHeilux, LLC
InventorsAaron J. Golle, John T. Golle, Walter J. Paciorek
Life of this patent
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Abstract
An example includes subject matter (such as an apparatus) comprising a planar substrate including a first surface that is planar, at least one bare light emitting diode (“LED”) die coupled to the substrate and conductive ink electrically coupling the at least one bare LED die, wherein the conductive ink is disposed on the substrate and extends onto a surface of the LED that is out-of-plane from the first surface.
Claims19
An apparatus, comprising:
- A circuit strip having a twisted “U” shape, the circuit strip comprising:
- A transparent substrate including a first surface and a vertically oriented surface perpendicular to the first surface;
- at least one bare light emitting diode (“LED”) die contacting the first surface of the transparent substrate, each of the at least one bare LED die comprising:
- planar N-doped region having a vertical surface and a surface positioned parallel to the transparent substrate and facing the first surface of the transparent substrate;
- and
- a P-doped region having a vertical surface and defining a mesa-shaped surface facing away from the first surface of the transparent substrate, the P-doped surface disposed parallel the N-doped surface;
- an insulator comprising non-conductive ink contacting vertical surfaces of the N-doped region, and the P-doped region of at least one of the bare LED dies and substrate;
- and
- conductive ink contacting the insulator wherein the at least one bare LED die is electrically coupled with the conductive ink.
6 more elements
An apparatus, comprising:
- A circuit strip having a twisted “U” shape, the circuit strip comprising:
- a transparent substrate including a first surface;
- at least one bare light emitting diode (“LED”) die coupled to the substrate, each of the at least one bare LED die comprising:
- a first N-doped region;
- and
- another doped region defining a mesa-shaped section;
- an insulative chip substrate disposed between the N-doped region and the transparent substrate;
- and
- conductive ink electrically connected to the at least one bare LED die, wherein the conductive ink contacts the transparent substrate and extends onto a surface of the LED that is out-of-plane from the first surface of the transparent substrate.
6 more elements
An apparatus, comprising:
- A circuit strip having a twisted “U” shape, the circuit strip comprising:
- A substrate through which light is radiated, including a horizontally-oriented surface and a vertically oriented surface;
- at least one bare light emitting diode (“LED”) contacting the horizontally-oriented surface of the substrate, each of the at least one bare LED die comprising:
- planar N-doped region having a vertical surface and a surface positioned parallel to the substrate and facing the horizontally oriented surface of the substrate;
- and
- a P-doped region having a vertical surface and defining a mesa-shaped surface facing away from the horizontally oriented surface of the substrate, the P-doped surface disposed parallel the N-doped surface;
- an insulator comprising non-conductive ink contacting vertical surfaces of the N-doped region, and the P-doped region of at least one of the bare LED dies and substrate;
- and
- conductive ink contacting the insulator wherein the at least one bare LED die is electrically coupled with the conductive ink.
6 more elements
Dependencies are inferred from the claim text.