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US 8,466,238 B2Granted
Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic EL displays
AssigneeMitsui Chemicals, Inc.
InventorsHiroaki Tamatani, Mitsuaki Chida, Yugo Yamamoto, Yuichi Ito, Takashi Nakano, Naritoshi Yoshimura
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Abstract
The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N—N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.
Claims8
An epoxy resin composition comprising (a) a latent curing agent and (b) an epoxy resin, wherein:
- (a) the latent curing agent is for curing (b) the epoxy resin, and comprises a hydroxyl-free amine imide having the following general formula (1):
- where R1 and R4 each denote an organic group and are the same or different;
- R2 and R3 independently denote a non-substituted or substituted alkyl or aryl group or are joined together to form a ring;
- R5 denotes an organic group;
- and none of R1 to R5 has an organic group reactive with (b) the epoxy resin,
- and having an N—N bond energy of 100 to 210 kJ/mol as determined by the B3LYP density functional method.
3 more elements
Dependencies are inferred from the claim text.