# US 8,465,837 B2 · Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,465,837 B2 - Document ID: US8465837B2 - Status: Granted - Kind: B2 - Application number: 12/531,308 - Filed: 2008-04-09 - Published: 2010-09-09 - Granted: 2013-06-18 - Earliest claimed: 2007-04-10 - Assignees: Sumitomo Bakelite Co., Ltd. - Applicants: Tadasuke Endo; Akihito Takahashi - Inventors: Tadasuke Endo; Akihito Takahashi - Web page: https://patentgrep.com/patent/US8465837B2 ## CPC - H05K 1/0353: {consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement} - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - C08L 79/04: Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors - C08K 3/013: Fillers, pigments or reinforcing additives - C08K 5/3445: Five-membered rings - C08L 61/32: Modified amine-aldehyde condensates - H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)} - H05K 2201/0209: Inorganic, non-metallic particles - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y10T 428/24994: Fiber embedded in or on the surface of a polymeric matrix - Y10T 428/31511: Of epoxy ether - Y10T 428/31522: Next to metal - Y10T 428/31529: Next to metal - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Disclosed is an epoxy resin composition essentially containing (A) an epoxy resin having a structure represented by the general formula (1), (B) a curing agent, (C) an inorganic filler and (D) a cyanate resin and/or a prepolymer thereof, wherein Ar represents a fused aromatic hydrocarbon group; r is an integer of 1 or more; X is a hydrogen or an epoxy group (glycidyl ether group); R1 represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n is an integer of 1 or more; p and q are an integer of 1 or more; and p's and q's in respective repeating units may be the same as or different from one another. ## Claims ### Claim 1 An epoxy resin composition comprising, as essential components, an epoxy resin (A) having a structure represented by general formula (1), a curing agent (B), an inorganic filler (C), and a cyanate resin and/or a prepolymer of the cyanate resin (D), wherein Ar represents a substituted fused aromatic hydrocarbon group; r is an integer of 1 or more; X represents a hydrogen or an epoxy group (glycidyl ether group); R1 represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n is an integer of 1 or more; each of p and q is an integer of 1 or more; p's and q's in respective repeating units may be the same as or different from one another, and wherein the substituted fused aromatic hydrocarbon group [Ar] in said epoxy resin (A) having the structure represented by general formula (1) is one selected from the group consisting of the structures represented by formulas (Ar1) to (Ar4), wherein R2 represents one selected from the group consisting of a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group. ### Claim 2 (depends on 1) The epoxy resin composition as claimed in claim 1, wherein said inorganic filler (C) is at least one selected from the group consisting of magnesium hydroxide, aluminum hydroxide, silica, talc, calcined talc and alumina. ### Claim 3 (depends on 1) The epoxy resin composition as claimed in claim 1, wherein a content of (A) said epoxy resin is 1% by weight to 20% by weight to the total amount of the resin composition. ### Claim 4 (depends on 1) The epoxy resin composition as claimed in claim 1, wherein the epoxy resin composition has a minimum melt viscosity of 2×102 (Pa·s) or less. ### Claim 5 (depends on 1) The epoxy resin composition as claimed in claim 1, wherein a content of said inorganic filler (C) is 20% by weight to 85% by weight to the total amount of the resin composition. ### Claim 6 (depends on 1) The epoxy resin composition as claimed in claim 1, wherein said cyanate resin (D) is a novolac type cyanate resin. ### Claim 7 (depends on 1) The epoxy resin composition as claimed in claim 1, wherein a content of said cyanate resin and/or prepolymer of the cyanate resin (D) is 3% by weight to 46% by weight to the total amount of the resin composition. ### Claim 8 (depends on 1) A prepreg prepared by impregnating a base material with the epoxy resin composition as claimed in claim 1. ### Claim 9 (depends on 8) A laminated board prepared by laminating one or more of the prepregs as claimed in claim 8. ### Claim 10 (depends on 9) A multilayer printed wiring board comprising the laminated board as claimed in claim 9. ### Claim 11 (depends on 8) A multilayer printed wiring board comprising the prepreg as claimed in claim 8. ### Claim 12 (depends on 11) A semiconductor device comprising the multilayer printed wiring board as claimed in claim 11. ### Claim 13 An epoxy resin composition for sheet comprising, as essential components, an epoxy resin (A) having a structure represented by general formula (1), a curing agent (B), an inorganic filler (C) and a cyanate resin and/or a prepolymer of the cyanate resin (D), wherein Ar represents a substituted fused aromatic hydrocarbon group; r is an integer of or more; X represents a hydrogen or an epoxy group (glycidyl ether group); R1 represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n is an integer of 1 or more; each of p and q is an integer of 1 or more; p's and q's in respective repeating units may be the same as or different from one another, and wherein the substituted fused aromatic hydrocarbon group [Ar] in said epoxy resin (A) having the structure represented by general formula (1) is one selected from the group consisting of the structures represented by formulas (Ar1) to (Ar4), wherein R2 represents one selected from the group consisting of a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group. ### Claim 14 An insulating resin sheet prepared by forming an insulating resin layer made of a resin composition comprising, as essential components, an epoxy resin (A) having a structure represented by general formula (1), a curing agent (B), an inorganic filler (C) and a cyanate resin and/or a prepolymer of the cyanate resin (D), over a carrier film or metal foil, wherein Ar represents a substituted fused aromatic hydrocarbon group; r is an integer of 1 or more; X represents a hydrogen or an epoxy group (glycidyl ether group); R1 represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n is an integer of 1 or more; each of p and q is an integer of 1 or more; p's and q's in respective repeating units may be the same as or different from one another, and wherein the substituted fused aromatic hydrocarbon group [Ar] in said epoxy resin (A) having the structure represented by general formula (1) is one selected from the group consisting of the structures represented by formulas (Ar1) to (Ar4), wherein R2 represents one selected from the group consisting of a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group. ### Claim 15 (depends on 14) The insulating resin sheet as claimed in claim 14, wherein said resin composition further comprises a phenoxy resin. ### Claim 16 (depends on 14) The insulating resin sheet as claimed in claim 14, wherein a content of said epoxy resin having the structure represented by general formula (1) (A) is 1% by weight to 20% by weight to the total amount of the resin composition. ### Claim 17 (depends on 14) The insulating resin sheet as claimed in claim 14, wherein said inorganic filler (C) is at least one selected from the group consisting of magnesium hydroxide, aluminum hydroxide, silica, talc, calcined talc and alumina. ### Claim 18 (depends on 14) The insulating resin sheet as claimed in claim 14, wherein a content of said inorganic filler (C) is 20% by weight to 85% by weight to the total amount of the resin composition. ### Claim 19 (depends on 14) A process for manufacturing a multilayer printed wiring board comprising laminating the insulating resin sheet as claimed in claim 14 on a surface of an inner circuit board having an inner circuit pattern, and forming an outer circuit in said insulating resin sheet. ### Claim 20 (depends on 19) The process for manufacturing a multilayer printed wiring board as claimed in claim 19, wherein said step of laminating is performed under heating and pressure in vacuo. ### Claim 21 (depends on 14) A multilayer printed wiring board comprising the insulating resin sheet as claimed in claim 14 laminated to a surface of an inner circuit board having a circuit pattern. ### Claim 22 (depends on 21) A semiconductor device comprising the multilayer printed wiring board as claimed in claim 21, in which a semiconductor element is mounted.