Method of depositing film by atomic layer deposition with pulse-time-modulated plasma

A method of depositing a film by atomic layer deposition (ALD) with pulse-time-modulated plasma, comprising:

• introducing a precursor gas in pulses over a substrate;
• introducing a reactant gas over a substrate;
• and
• applying pulse-time-modulated RF power in pulses onto the substrate, wherein a main pulse of the pulse-time-modulated RF power is applied onto the substrate during intervals between two consecutive pulses of the precursor gas while the reactant gas is being introduced and no pulse of the pulse-time-modulated RF power is applied onto the substrate during the pulses of the precursor gas,
• wherein the main pulse of the pulse-time-modulated RF power is comprised of a plurality of secondary pulses of RF power wherein one cycle of each secondary pulse is about 3 milliseconds (msec) to about 1,000 msec, and a duty of the cycle is about 60% or higher, wherein a duration of no RF power period between two consecutive secondary pulses of RF power is about 1 msec to about 300 msec.