# US 8,465,793 B2 · Process for the preparation of a shaped substrate for a coated conductor

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- Number: US 8,465,793 B2
- Document ID: US8465793B2
- Status: Granted
- Kind: B2
- Application number: 12/477,392
- Filed: 2009-06-03
- Published: 2010-06-10
- Granted: 2013-06-18
- Earliest claimed: 2008-02-06
- Assignees: Nexans
- Applicants: Jürgen Ehrenberg; Mark Rikel
- Inventors: Jürgen Ehrenberg; Mark Rikel
- Web page: https://patentgrep.com/patent/US8465793B2

## CPC

- H10N 60/0632: {Intermediate layers, e.g. for growth control}
- Y10T 428/24628: Nonplanar uniform thickness material
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A process for preparing a shaped substrate suitable in the production of coated conductors which process allows the deformation of a textured substrate onto which a textured buffer layer has been already grown.

## Claims

### Claim 1

Process for preparing a shaped substrate with curved surface suitable in the production of coated conductors comprising the steps of:
first providing a textured substrate with planar surface and an initial texture with one or more first textured buffer layer(s), said first textured buffer layer(s) adopting said initial texture of the substrate;
subjecting the substrate, covered with the first initial buffer layer(s), to a shaping step, wherein, in the shaping step, the planar surface of said substrate is deformed to a curved surface wherein the substrate is shaped to have any one of a round, an elliptical or a polygonal cross sectional area; and
after shaping said substrate, providing a second additional buffer layer onto the first buffer layer(s) by epitaxial growth, wherein said second buffer layer obtains said initial texture of said substrate.

### Claim 2 (depends on 1)

Process according to claim 1, wherein a substrate is used having a biaxial texture.

### Claim 3 (depends on 1)

Process according to claim 1, wherein for the uppermost initial and additional buffer layer the same material is used.

### Claim 4 (depends on 1)

Process according to claim 1, wherein the shaping step is at least one selected from rolling, drawing and welding.

### Claim 5 (depends on 1)

Process according to claim 1, wherein the substrate is a flat tape which is bended around its longitudinal axis into a round wire shape.

### Claim 6 (depends on 1)

Process according to claim 1, wherein the material for the initial and additional buffer layers is at least one selected from the group consisting of MgO, yttria stabilized zirconia, (Ce1−ZREZ)O2 with 0≦z≦0.5, REMnO3 and RE2−xB2+xO7 with −0.4≦x≦+0.7 and with RE being at least one selected from La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Y, Tm, Yb and Lu, and B being at least one selected from Zr and Hf.