# US 8,464,589 B2 · Micro-electromechanical systems (MEMS) structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,464,589 B2 - Document ID: US8464589B2 - Status: Granted - Kind: B2 - Application number: 12/904,169 - Filed: 2010-10-14 - Published: 2012-04-19 - Granted: 2013-06-18 - Earliest claimed: 2010-10-14 - Assignees: Solid State System Co., Ltd. - Applicants: Chien-Hsing Lee; Tsung-Min Hsieh; Li-Chi Tsao; Jhyy-Cheng Liou - Inventors: Chien-Hsing Lee; Tsung-Min Hsieh; Li-Chi Tsao; Jhyy-Cheng Liou - Web page: https://patentgrep.com/patent/US8464589B2 ## CPC - B81B 3/0072: {For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers} - H04R 19/005: {using semiconductor materials} - B81B 2201/0257: Microphones or microspeakers - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) ## Abstract A MEMS structure includes a substrate, a structural dielectric layer, and a diaphragm. A structural dielectric layer is disposed over the substrate. The diaphragm is held by the structural dielectric layer at a peripheral end. The diaphragm includes multiple trench/ridge rings at a peripheral region surrounding a central region of the diaphragm. A corrugated structure is located at the central region of the diaphragm, surrounded by the trench/indent rings. ## Claims ### Claim 1 A micro-electromechanical systems (MEMS) structure, comprising: a substrate, having a front side and a back side, wherein the substrate have a predeteimined region; a structural dielectric layer, disposed over the front side of the substrate; a diaphragm, held by the structural dielectric layer at a peripheral end, wherein the diaphragm is above the substrate corresponding to the predeteimined region and forms a chamber between the substrate and the diaphragm, the chamber is connected to an outer space by multiple through holes in the substrate or in a structure layer on the front side of the substrate, or in both the substrate and the structure layer, wherein the diaphragm comprises: a plurality of trench/ridge rings at a peripheral region surrounding a central region of the diaphragm; and a corrugated structure, located at the central region of the diaphragm, surrounded by the trench/ridge rings. ### Claim 2 (depends on 1) The MEMS structure of claim 1, wherein the trench/ridge rings are discontinuous, each of the trench/ridge rings being discontinuous is formed by a plurality of trench/ridge segments. ### Claim 3 (depends on 2) The MEMS structure of claim 2, wherein multiple gaps between the trench/ridge segments in each of the trench/ridge rings are blocked by the trench/ridge segments of at least another one of the discontinuous trenches in a radiant direction from a center. ### Claim 4 (depends on 3) The MEMS structure of claim 3, wherein the corrugated structure of the diaphragm comprises a plurality of indent/protruding units, arranged in a honey-comb-like geometric structure. ### Claim 5 (depends on 4) The MEMS structure of claim 4, wherein each of the indent/protruding units comprises an enclosed ring of trench/ridge to surround an inner region. ### Claim 6 (depends on 5) The MEMS structure of claim 5, wherein the enclosed ring of trench/ridge in geometric shape is polygon, circular or hexagonal. ### Claim 7 (depends on 4) The MEMS structure of claim 4, wherein each of the indent/protruding units comprises an enclosed ring of trench/ridge to surround an inner region and a center trench/ridge within the inner region. ### Claim 8 (depends on 7) The MEMS structure of claim 7, wherein the enclosed ring of trench/ridge in geometric shape is polygon, circular or hexagonal. ### Claim 9 (depends on 2) The MEMS structure of claim 2, wherein multiple gaps between the trench/ridge segments in each of the trench/ridge rings are aligned to form a radiant gap line. ### Claim 10 (depends on 9) The MEMS structure of claim 9, wherein the corrugated structure of the diaphragm comprises a plurality of indent/protruding units, arranged in a honey-comb-like geometric structure. ### Claim 11 (depends on 10) The MEMS structure of claim 10, wherein each of the indent/protruding units comprises an enclosed trench/ridge to surround an inner region. ### Claim 12 (depends on 11) The MEMS structure of claim 11, wherein the enclosed trench/ridge in geometric shape is polygon, circular or hexagonal. ### Claim 13 (depends on 10) The MEMS structure of claim 10, wherein each of the indent/protruding units comprises an enclosed trench/ridge to surround an inner region and a center trench/ridge in the inner region. ### Claim 14 (depends on 13) The MEMS structure of claim 13, wherein the enclosed trench/ridge in geometric shape is polygon, circular or hexagonal. ### Claim 15 (depends on 1) The MEMS structure of claim 1, wherein the trench/ridge rings include at least one being discontinuous and formed by a plurality of trench/ridge segments and at least one continuous ring. ### Claim 16 (depends on 1) The MEMS structure of claim 1, wherein the diaphragm is a single layer formed by a single material. ### Claim 17 (depends on 1) The MEMS structure of claim 1, wherein the diaphragm is a stacked layer. ### Claim 18 (depends on 1) The MEMS structure of claim 1, wherein the diaphragm has a stacked portion just at the trench/ridge rings. ### Claim 19 (depends on 1) The MEMS structure of claim 1, wherein the corrugated structure of the diaphragm comprises a plurality of indent/protruding units, arranged in a honey-comb-like geometric structure. ### Claim 20 A micro-electromechanical systems (MEMS) structure, comprising: a substrate, having a front side and a back side, wherein the substrate have a predetermined region; a structural dielectric layer, disposed over the front side of the substrate; a diaphragm, held by the structural dielectric layer at a peripheral end, wherein the diaphragm is above the substrate corresponding to the predetermined region and forms a chamber between the substrate and the diaphragm, the chamber is connected to an outer space by multiple through venting holes in the substrate or in a structure layer on the front side of the substrate, or in both the substrate and the structure layer, wherein the diaphragm comprises a plurality of trench/ridge rings at a peripheral region surrounding a central region of the diaphragm, and each of the trench/ridge rings is discontinuous and formed by a plurality of trench/ridge segments.