Method of manufacturing a micro-electro-mechanical system (MEMS)
AssigneeInternational Business Machines Corporation
InventorsAnthony K. Stamper, John G. Twombly
Life of this patent
Estimating the term…
Abstract
A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is movable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.
Claims29
A method of forming at least one Micro-Electro-Mechanical System (MEMS), comprising:
- patterning a wiring layer to form at least one fixed plate;
- forming a sacrificial material on the wiring layer;
- forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and the sacrificial material;
- forming at least one MEMS beam that is moveable over the at least one fixed plate;
- and
- venting or stripping of the sacrificial material to form at least a first cavity.
A method of forming at least one Micro-Electro-Mechanical System (MEMS), comprising:
- patterning a wiring layer containing aluminum to form at least one fixed plate on a substrate;
- depositing a dielectric layer over the at least one fixed plate on the at least one fixed plate;
- depositing a sacrificial silicon layer on top of the dielectric layer, and over the at least one fixed plate, wherein the dielectric layer blocks reaction, alloying, or interdiffusion of the aluminum and the sacrificial silicon layer during the depositing of the sacrificial silicon layer;
- forming at least one MEMS beam above the at least one fixed plate;
- and
- venting or stripping of the sacrificial silicon layer to form at least a first cavity.
Dependencies are inferred from the claim text.