Region divided substrate and semiconductor device
AssigneeDenso Corporation
InventorsTetsuo Fujii, Masaya Tanaka, Keisuke Gotoh
Life of this patent
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Abstract
A region divided substrate includes a substrate, a plurality of trenches, a conductive layer, and an insulating member. The substrate has a first surface and a second surface opposed to each other. The trenches penetrate the substrate from the first surface to the second surface and divide the substrate into a plurality of partial regions. The conductive layer is disposed on a sidewall of each of the trenches from a portion adjacent to the first surface to a portion adjacent to the second surface. The conductive layer has an electric conductivity higher than an electric conductivity of the substrate. The insulating member fills each of the trenches through the conductive layer.
Claims29
A region divided substrate comprising:
- a substrate having a first surface and a second surface opposed to each other;
- a plurality of trenches penetrating the substrate from the first surface to the second surface and dividing the substrate into a plurality of partial regions;
- a conductive layer disposed on a sidewall of each of the plurality of trenches from a portion adjacent to the first surface to a portion adjacent to the second surface, the conductive layer having an electric conductivity higher than an electric conductivity of the substrate;
- and
- an insulating member filling each of the plurality of trenches through the conductive layer.
Dependencies are inferred from the claim text.